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  February 9th - 07:24 am
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C O N T E N T S
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  >  TOP STORY
 
 
  Samsung presents new 3D TSV Packaging Roadmap
Everything really started on April 2006 and later on April 2007 when Dr Chang-Gyu - Samsung's Hwang President & CEO - announced the company intention to commercialize 3D TSV stacked NAND Flash memory and 3D TSV stacked DRAM memory.  Talking about 3D silicon integration at that time, Dr Chang even said "we are at the doorstep of the largest shift  in the semiconductor industry ...
  >  LATEST INTERVIEW
 
 
  Sensonor looks to higher value markets
Cut loose from Infineon and independent again, Sensonor is hitting the ground running with a new line of high performance gyroscopes clusters targeting applications now served by fiber optic gyros, and a line of thermal imaging products to be introduced early next year....
  >  NEW YOLE REPORT
 
 
  Power electronics in electric and hybrid vehicles
The HEV and EV power electronics market is booming and may use SiC or GaN technologies before 2020
  >  YOLE INDEX


Difficult times.
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  >  NEWS FROM THE PUBLICATION
 Share with our experts our anticipation of the crisis
See our different webcast on MEMS, PV, Nanomaterial, compound Semi, 3DPackaging
 Publication
Discover our magazines Micronews, 3D Packaging, PV Manufacturing and MEMS Trends.
 Reports
Visit our Reports section and buy online part of the report when available
  >  TOP 20 NEWS
 
 
  >  TOP READ NEWS
 
  SVTC forms advisory board, leveraging distinguished thought leaders in industry
 
  Samsung presents new 3D TSV Packaging Roadmap
 
  Oclaro acquires WSS company Xtellus
 
  Yingli Green Energy announces global sponsorship of 2010 FIFA World Cup
 
  C-MAC microtechnology announces further development of high temperature DC-DC
 
  LG Innotek targeting $3.5 billion in revenue thanks to LEDs
 
  Introducing innovative nanotechnology into the value chain of the lubricants ma
 
  bioMérieux - 2009 Business Review
  >  LATEST NEWS
 
  100GHz RF graphene transistor trumps GaAs ICs
 
  Roth & Rau AG takes over solar activities of the OTB group B.V.
 
  Fluidigm and IntegraGen join forces to create a genetic analysis service and
 
  Measurement specialties announces third quarter fiscal year 2010 results
 
  Introducing innovative nanotechnology into the value chain of the lubricants ma
 
  Germanium laser in move toward computers that use light instead of electricity
 
  IPDIA opens multi-parties 3D TSV Silicon Interposer Program
 
  C-MAC microtechnology announces further development of high temperature DC-DC
  >  TO MEET WITH US
 
  MEMS
> Smart System Integration (March 23-24, Como, Italy)
> World Micromachine Summit (April 28-30, Dortmund, Germany)
> AMAA - Advanced Microsystems for Automotive Applications (May 10-11, Berlin, Germany)
> Metric (May 18-19, San Jose, California)

  COMPOUND SEMI
> CS Mantech (May 17-20, Portland, OR, USA)

  MICROFLUIDICS
> IMRET 11 (March 8-10, Kyoto, Japan)

  PHOTOVOLTAIC
> PV Expo Japan (March 3-5, Tokyo, Japan)
> Thin Film Solar Summit (March 17-18, Berlin, Germany)
> Photon's 8th Solar Silicon Conference (April 27, Stuttgart, Germany)

  ADVANCED PACKAGING: 3D IC, WLP & TSV
> MEPTEC - From chip to system: Design challenges & solutions (February 25, San Jose, CA, USA)
> BiTS Workshop 2010 (March 7-10, Mesa, Arizona)
> IMAPS 2010 (March 9-11, Scottsdale, AZ, USA)
> DATE 2010 Friday Workshop on 3D Integration (March 12, Dresden, Germany)
> Image Sensors Europe 2010 (March 23-25, London, UK)
> ICEP - International Conference on Electronics Packaging (May 12-14, Hokkaido, Japan)

  POWER ELECTRONICS
> APEC (February 21-25, Palm Springs, CA, USA)
> CIPS 2010 (March 16-18, Nuremberg, Germany)
> International Conference Chassis Electrification (April 21-23, Wiesbaden, Germany)

 
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