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"As the first to deliver a 12-micron thermal camera core, we’re providing our customers a tremendous competitive advantage, helping them drive down system costs while providing superior imagery typically associated with our MicroIR products," said Christian Rodriguez, business development at BAE Systems. "Our TWV640 module empowers our customers to create and deliver a new ...

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PZT thin films seem to be a hot topic at MEMS research labs these days, with their potential to improve the performance of many MEMS actuators, if a technology can be developed for low cost volume production. Dutch equipment startup SolMateS claims its pulsed laser deposition tool could be the enabler....

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  3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?
 
  Sapphire Applications & Market: from LED to Consumer Electronic - August 2014 Edition
Apple saved the sapphire industry in 2013 and could transform it in 2014. Will the revolution happen?
 
  Status of the MEMS Industry 2014
Challenged by newcomers proposing innovative low-cost solutions for consumer applications, established MEMS players must develop new strategies to ensure continued growth.
 
  Bosch Sensortec BMA355 3-Axis MEMS Accelerometer
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)

 
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PZT thin films, 300mm, magnetic materials,
new detection principles… What does the future
hold for MEMS production?

In this issue of MEMS' Trends, we’re giving some attention to MEMS technology evolution, since this is ...


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