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  CIS thin-film module manufacturer Soltecture GmbH applied to open insolvency proceedings
• The company recently introduced a new evaporation technology resulting in high module efficiency
• Soltecture focuses on the BIPV market The executive management of Soltecture GmbH applied to open insolvency proceedings. The responsible insolvency court in Berlin Charlottenburg has appointed Hartwig Albers from the law firm Brinkmann & Partner as the preliminary insolvency ...
  >  LATEST INTERVIEW
 
 
  InvenSense sees 65% growth as motion processing becomes must-have for handhelds
The fabless startup capitalized on the growth of the motion interface market to see ~65% growth, to ~$144 million in sales in CY 2011, vaulting into the top 20 MEMS companies, and pulling off the MEMS sector’s fi rst major IPO....
  >  YOLE DEVELOPPEMENT REPORT
 
 
  Deep Reactive Ion Etching
The number of wafers processed with DRIE will see 5X growth 2011 – 2017
 
  MEMS for Cell Phones & Tablets
20% annual growth to reach $5.4B in 2017!
 
  Polymeric Materials for 3DIC & WLP Applications
The first complete report analyzing in detail the opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications.
 
  CREE - XLAMP® XB-D COOL WHITE LED
Teardown and Reverse Costing for the latest Xlamp® XB-D, the new cool white LED supplied by Cree, Inc.
  >  YOLE DEVELOPPEMENT EVENTS
 
  ISiCPEAW 2012
This workshop presents advances in silicon carbide technology with a strong focus on Power Electronics applications. ...
 
  MEMS in Motion
MEMS in Motion Collaboration SummitTM Sept. 12–13, 2012 Palm Springs, CA The MEMS in Motion Collaboration Summit is ...
 
  Power in Flux
Industry leaders will gather for two days of collaboration and networking at Power in Flux 2012 The Power in Flux ...
 
  Connect in 3D
The Connect in 3D Collaboration Summit is an unprecedented networking event engineered for the global supply system ...
 
  >  MARKET & FINANCIAL BUZZ
 
 
 MEMS Ranking

New
Top 20 MEMS Foundry ranking - Sales 2011
New
Top 30 Worldwide MEMS Companies - 2011 Revenues
Top 30 Worldwide MEMS Companies - 2010 Revenues
Top 20 MEMS Foundry ranking - Sales 2010

  >  NEWS FROM THE PUBLICATION
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Discover our magazines Micronews, 3D Packaging, PV Manufacturing, Efficien'Si and MEMS Trends.
 Reports
Visit our Reports section and buy online part of the report when available
  >  TOP 20 NEWS
 
 
  >  TECHNOLOGY MAGAZINE
 
 
Download our latest magazines
This new issue of MEMSTrends is dedicated to our update of the MEMS markets and MEMS players’ ranking. The MEMS market will continue to see steady, sustainable double-digit growth for the next six years......

  >  TOP READ NEWS
 
  GLOBALFOUNDRIES adds tools to enable 3DIC for next-gen mobile and consumer app
 
  Yole Développement top 30 MEMS ranking: STMicroelectronics challenges Texas
 
  The Europe’s Heterogeneous Technology Alliance (HTA) has the ambition to
 
  “UV LEDs should represent about 28% of the total UV lamp market (M$) by 2016”
 
  GaN Systems & APEI to package gallium nitride power transistors
 
  Cree Technology breakthrough enables 50 amp silicon carbide power devices,
 
  Rusnano backs NeoPhotonics in $40M deal
 
  The Domino effect hits point of care testing
 
  Next-Generation Nanoelectronics: A decade of progress, coming advances
  >  LATEST NEWS
 
  Long-term research project on safety of nanomaterials launched
 
  SPTS expands Chinese customer base with PVD win
 
  EMCORE Corporation completes sale of VCSEL-based product lines to Sumitomo
 
  Amtech to introduce new ion implant & PECVD products at the SNEC
 
  Microfluidic device filters blood
 
  Molding Technologies: a closer look
 
  Bridgelux and Toshiba achieve world class performance for 8 inch GaN-On-Silicon
 
  IR introduces Ultra-fast switching, rugged 600V IGBTs for automotive applicatio
 
  Cree Technology breakthrough enables 50 amp silicon carbide power devices,
  >  TO MEET WITH US
 
  MEMS
> Sensors + Tests (May 22-24, Nuremberg, Germany)
> MEPTEC - MEMS Technology Symposium (May 23, San José, CA, USA)
> MEMS in Motion (September 12-13, Palm Springs, CA, USA)

  NANOMATERIALS
> Nanofair 2012-9th International Nanotechnology Symposiu (June 12-13, Dresden, Germany)
> Nanotech - Conference & Expo (June 18-21, Santa Clara, CA, USA)
> COMS - Commercialization of Micro and Nano Systems (June 24-27, Tonsberg, Norway)
> Nanosafe 2012 (November 13-15, Grenoble, France)

  COMPOUND SEMI
> ISiCPEAW 2012 (May 29-30, Stockholm, Sweden)
> ISiCPEAW (May 29-30, Krista, Sweden)

  MEDTECH
> European LabAutomation (May 30-31, Hamburg, Germany)
> EuroMedtech (May 31 - June 1, Grenoble, France)

  PHOTOVOLTAICS
> SEMICON West / Intersolar US (July 10-12, San Francisco, CA, USA)
> 27th EU PVSEC (September 24-28, Frankfurt, Germany)

  ADVANCED PACKAGING
> IEEE Workshop 
on Low Temperature Bonding for 3D Integration (May 22-23, Tokyo, Japan)
> ECTC (May 29 - June 1, San Diego, CA, USA)
> SEMI Forum Japan (June 13-14, Osaka, Japan)
> Connect in 3D (October 31 - November 1, Palm Springs, CA, USA)

  POWER ELECTRONICS
> PCIM Asia (June 21-23, Shanghai, China)
> Power in Flux (October 29-30, Palm Springs, CA, USA)

  LED
> LED Lighting Taiwan (June 19-21, Taipei, Taiwan)

 
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