I-Micronews

LATEST REPORTS
STMicroelectronics HTS221 Humidity and Temperature Sensor MEMS Microphone Patent Infringement

Imaging

LATEST REPORTS
Mobileye EyeQ3® Automotive Vision-Based SoC Huawei Ascend Mate 7 Fingerprint Sensor Fingerprint Cards FPC1020

MedTech

LATEST REPORTS
Biomedical Photoacoustic Imaging Patent Landscape Status of the CMOS Image Sensor Industry report

Compound Semi.

LATEST REPORTS
CREE 1700V SiC Module - First 1700V SiC MOSFET with Z-Rec SiC Diode MEMS Price+

LED

LATEST REPORTS
Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays UV LED - Technology, Manufacturing and Application Trends

Photonics

LATEST REPORTS
Mobileye EyeQ3® Automotive Vision-Based SoC Biomedical Photoacoustic Imaging Patent Landscape

Power Electronics

LATEST REPORTS
CREE 1700V SiC Module - First 1700V SiC MOSFET with Z-Rec SiC Diode Power Packaging Technology Trends and Market Expectations

Photovoltaics

LATEST REPORTS
TIGO Energy MM-2ES 50 Dual Maximizer Emerging and Innovative Approaches in Photovoltaics

Advanced Packaging

LATEST REPORTS
Power Packaging Technology Trends and Market Expectations MEMS Price+

Manufacturing

LATEST REPORTS
Fan-Out and Embedded Die: Technologies & Market Trends Emerging Non Volatile Memory (NVM) Technology & Market Trends Report

Slider home

HEADLINES

Why Apple has purchased camera technology company LinX and what will happen now?

Details: Imaging; April 22, 2015

LinX is an Israeli startup providing multi-aperture cameras that promise smaller smartphone camera modules with better image quality. The idea is fairly simple: Instead of having a single large image sensor with a lot of pixels and the large optics that go with it, LinX’s imaging device is split into 2-4 smaller sub-cameras...

Yole organizes a Power Electronics Market Briefing during PCIM Europe

Details: Power Electronics; April 17, 2015

This year again Yole Développement organizes its Power Electronics Market Briefing during the PCIM Europe show. Entitled"How are hybrid and electric going to reshape the overall power electronics industry?", the 2015 edition will take place on May 20, 2015 in the Forum Area of PCIM Europe (Nuremberg, Germany), from 10:00 to 11:00 AM.

LED phosphors market: “Strong price pressure stalls revenue growth and pressures margins but masks a more complex picture”, announces Yole Développement

Details: LED; April 24, 2015

While volumes are expected to more than double between 2015 and 2020, LED phosphor prices have declined dramatically, leading to a flat revenue outlook. Low technology barriers of entrance on the most mature compositions have prompted companies to procure turnkey manufacturing equipment and enter the market.

China installed 5.04 GW of new photovoltaic capacity in Q1 2015

Details: Photovoltaics; April 21, 2015

According to China’s National Energy Administration (NEA), at the end of March 2015, the Chinese PV cumulative installed capacity reached 33.12 million kilowatts, of which, 27.79 million kilowatts of photovoltaic power plants, PV distributed 5.33 million kilowatts.

Quantum dots for displays and lighting are now entering volume production

Details: LED; April 16, 2015

LED phosphors are key elements for the quality of the light, from industrial to automotive applications and also general lighting. Yole Développement has published a new report ("Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays") covering the evolution of these products, both in terms of market and applications but also technology trends, as quantum dots are now entering volume production for display applications and could be adopted as well for lighting applications in the next 3 to 4 years.

Advanced WLP at Amkor: a closer look

Details: Advanced Packaging; April 15, 2015

From Dr. Phil Garrou for Yole Développement - At the recent IMAPS Device Packaging Conference Amkor gave several papers defining their Advanced WLP Positioning. Both SWIFT (Silicon Wafer Integrated Fan Out Tech) and SLIM (Silicon less integrated module) are high density packages fabricated without TSV technology and thus can be viewed as alternatives to 2.5/3DIC. i-Micronews thought they were worth... a closer look .