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  July 4th - 01:23 am
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  Osram launches two Ostar LEDs for projection
OSRAM Opto Semiconductors is enriching the projection market with two new LEDs, OSTAR Compact and OSTAR Power Projection. OSTAR Compact is designed for small efficient systems in cell phones, PDAs and MP4 players, while OSTAR Power Projection is targeted at high-performance projection applications such as home cinema systems of 70 inches and more. The LED portfolio from this semiconductor ...
  >  LAST INTERVIEW
 
 
  Bringing your MEMS to market
Micralyne is one of the world’s largest, independent, MEMS development and MEMS manufacturing service providers. With its headquarters in Edmonton, Alberta, Canada, Micralyne services a diverse customer base with applications in, automotive sensors for control systems, lab-on-a-chip devices for drug discovery, MEMS optical switching and attenuation technology in telecommunication networks, optical...
  >  NEW YOLE REPORT
 
 
  MEMS Foundries 2009
Exclusive analysis of the MEMS foundry business
  >  YOLE INDEX


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  >  NEWS FROM THE PUBLICATION
 Share with our experts our anticipation of the crisis
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 MEMSentry
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 Reports
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  >  TOP 20 NEWS
 
 
  >  TOP READ NEWS
 
  3D Integration for wireless products: An industrial perspective
 
  Abound Solar, harnessing the power of the sun
 
  2008 TOP 20 MEMS foundries: Micralyne, first foundry in the open market
 
  High resolution interferometer from TEEM PHOTONICS
 
  Nitronex snubbed by RFHIC's Cree switch
 
  World's largest carbon nanotube manufacturing plant of 500 t/y commissioned
 
  Integrated Fluidic Circuit
 
  Fujitsu Develops GaN HEMT for Power Supply
 
  CDE ResMap Chosen by ISMI to Support 450mm Process Development
  >  LATEST NEWS
 
  DuPont, U.S. Dept. of Energy Partner on Innovative Thin Film Solar Program
 
  SUSS MicroTec strengthens presence in Asia with new sales structure
 
  EU "MORGaN" project announces GaN-on-diamond growth
 
  Financing Led by SLS Invest Will Fund Gyros to Profitability
 
  X-FAB to Close 6-Inch Production at Plymouth, UK Fab
 
  Fuji Electric and Furukawa Partner on GaN Power Devices
 
  3D Integration for wireless products: An industrial perspective
 
  World's largest carbon nanotube manufacturing plant of 500 t/y commissioned
 
  High resolution interferometer from TEEM PHOTONICS
  >  TO MEET WITH US
 
  MEMS
> Semicon West (July 14-16, San Francisco, USA)
> Micromachine (July 29-31, Tokyo, Japan)

  NANOMATERIALS
> NanoEurope (August 27-28, St Gallen, Suitzerland)

  COMPOUND SEMI
> ICSCRM (October 11-16, Nuremberg, Germany)
> ICNS-8 (October 18-23, ICC Jeju, Korea)

  PHOTOVOLTAIC
> Intersolar US (July 14-16, San Francisco, USA)

  ADVANCED PACKAGING: 3D IC, WLP & TSV
> SEMATECH Workshop on 3D Interconnect Metrology (July 15, San Francisco , USA)
>  IEEE 3D System Integration Conference 2009 (September 28-30, San Francisco, USA)
> 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition (December 9-11, Burlingame, USA)

 
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