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  February 9th - 07:24 am
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Everything really started on April 2006 and later on April 2007 when Dr Chang-Gyu - Samsung's Hwang President & CEO - announced the company intention to commercialize 3D TSV stacked NAND Flash memory and 3D TSV stacked DRAM memory.  Talking about 3D silicon integration at that time, Dr Chang even said "we are at the doorstep of the largest shift  in the semiconductor industry ...

  >  LATEST INTERVIEW
 
Cut loose from Infineon and independent again, Sensonor is hitting the ground running with a new line of high performance gyroscopes clusters targeting applications now served by fiber optic gyros, and a line of thermal imaging products to be introduced early next year....

  >  NEW YOLE REPORT
 
The HEV and EV power electronics market is booming and may use SiC or GaN technologies before 2020

  >  YOLE INDEX


Difficult times.
Click here to see the evolution of Yole Index.
 

 
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