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  >  TOP STORY
 
 
  Phosphors for LED manufacturing

More information available soon

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  >  LATEST INTERVIEW
 
 
  Raytheon rides the wave of SiC’s efficiency
The company’s recently-opened £3.5 million 4-inch SiC foundry in Glenrothes, UK, will produce devices for both new entrants and established players, explain Paul D’Arcy, Business Unit Manager for Semiconductors, and Ewan Ramsay, Principal Engineer....
  >  YOLE DEVELOPPEMENT REPORT
 
 
  IGBT Markets and Application Trends
IGBT application growth will lead the market to $6B+ by 2018
 
  2.5D, 3DIC and TSV Interconnect Patent Investigation
3DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation.
 
  SiC Market 2013
Displacement of silicon has already begun...
 
  Flexible Applications Based on Printed Electronics Technologies
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
 
  >  MARKET & FINANCIAL BUZZ
 
 
 MEMS Ranking

New
Top 20 MEMS Foundry ranking - Sales 2011
New
Top 30 Worldwide MEMS Companies - 2011 Revenues
Top 30 Worldwide MEMS Companies - 2010 Revenues
Top 20 MEMS Foundry ranking - Sales 2010

  >  NEWS FROM THE PUBLICATION
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 Reports
Visit our Reports section and buy online part of the report when available
  >  TOP 20 NEWS
 
 
  >  TECHNOLOGY MAGAZINE
 
 
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The $1B MEMS business model
Despite widespread semiconductor market contraction, the 2012 MEMS segment
exhibited strong unit and business growth. This growth directly correlates with
the tremendous development of new portable...

  >  TOP READ NEWS
 
  Solder filling of TSV: a closer look
 
  Despite overall power electronics 2012 downturn, SiC kept on growing
 
  New Freescale Xtrinsic intelligent sensor hub integrates programmability and
 
  Teem Photonics appoints Market Tech, Inc. as USA distributor
 
  Mitsubishi Electric launches SiC Power Semiconductor modules
 
  alfasolar GmbH applied for preliminary insolvency
 
  e2v image sensors study the earth‘s vegetation on board Proba-V, ESA’s newly
 
  Philips introduces the LUXEON 3535 2D, reduces LED count in retrofit lamps by 5
 
  A new type of laser created at University of Würtzburg
 
  Pacific Biosciences and Sage Science announce co-marketing partnership
  >  LATEST NEWS
 
  Infineon showcases 650V TRENCHSTOP™ 5
 
  ON Semiconductor awarded title III government funding for development of
 
  Microfluidic electrophysiological device helps record brain activity of worms in
 
  Invensas demos new high bandwidth packaging solution for mobile devices at 2013
 
  Qualcomm shows off Mirasol, 1.5-inch panel shipping in products soon
 
  Micromirror development tool takes aim at 3-D printing
 
  A new type of laser created at University of Würtzburg
 
  IQE and II-VI Inc. launch 150mm GaN HEMT epi wafers on SiC substrates
 
  PV Manufacturing at Intersolar Europe 2013
 
  Philips introduces the LUXEON 3535 2D, reduces LED count in retrofit lamps by 5
  >  TO MEET WITH US
 
  MEMS
> Sensors Expo & Conf. (June 5-6, Rosemont, USA)
> Transducers (June 16-20, Barcelona, Spain)
> Annual Review LETI (June 25-26, Grenoble, France)
All MEMS events

  MEDTECH
> Lab-on-a-Chip World Congress (September 12-13, San Diego, USA)
All MedTech events

  ADVANCED PACKAGING
> Advancements in Thermal Management 2013 (June 6-7, Denver, Colorado, USA)
All Advanced Packaging events

  LED
> Opto Taiwan / LED Lighting Taiwan (June 18-20, Taipei, Taiwan)
> LpS (LED professional Symposium) (September 24-26, Bregenz, Austria)
All LED events

 
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