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Home  > ADVANCED PACKAGING
  > ADVANCED PACKAGING
 
  >  TOP STORY
Solder filling of TSV: a closer look
One of the options being put forth is the filling of TSV with solder. Although less electrically conductive than copper the solder filled TSV are a closer CTE match to silicon and may be acceptable for numerous applications.  I-Micronews thought this TSV option was worth … “A ...

 
  >  ANALYSIS
Packaging beyond the mainstream
Emerging volume markets in MEMS, LEDs, power devices and even silicon photonics mean an increasing diversity of demands and
opportunities for semiconductor packaging technology....

Source: 3D Packaging - Feb. 2013 - Powered by Yole Développement

 
  >  INTERVIEW
WLP promises LED price and performance benefits
VisEra Technologies’ director of R&D, LED business, T. H. Lin explains how his company’s wafer level packaging economically delivers more uniform color and improved thermal properties....
 
  >  REVERSE ENGINEERING
POSSUM die design as a low cost 3D packaging alternative
The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration has focused on (a) reduced form factor in the X, Y, and Z dimensions, (b) more functions combined within a single package, and (c) improved electrical and thermal performance (reduced electrical and parasitic resistance and lower energy consumption)....

Source: 3D Packaging - Nov. 2012 - Amkor Technology special issue
 
  >  PRESENTATION
3DIC & 2.5D Interposer applications, market trends and supply chain evolutions
Feel free to download Lionel Cadix's presentation held at 3D RTI 2012 ...
 
  >  TRADE SHOWS & CONFERENCES
Advancements in Thermal Management 2013
Advancements in Thermal Management 2013 will be held June 6-7, 2013 in Denver, Colorado. This conference will discuss the latest developments in thermal technology for cooling, temperature sensing and control, materials, and systems design for optimizing thermal properties. ...
 
  >  TECHNOLOGY MAGAZINE
 
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February 2013

November 2012
 
  >  LATEST REPORT
2.5D, 3DIC and TSV Interconnect Patent Investigation
3DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation....
 
  >  NEWS

May 22nd 2013
The new integration will focus on fast, automated verification of die-to-die ...

May 21st 2013
Yole Développement announces its 2.5D, 3DIC and TSV Interconnect Patent ...

May 18th 2013
Independent package development and assembly specialists Sencio BV is bringing an extra...

May 17th 2013
One of the options being put forth is the filling of TSV with solder. Although less ...

May 17th 2013
ASE has not provided a date to close the acquisition. Named Wuxi Tongzhi ...

May 16th 2013
SPIL reported a net loss of NT$ 292 million for the first quarter of 2013, compared ...

May 16th 2013
During an extensive test and qualification period at the customer site, the customer ...

May 15th 2013
The program, “Processes for MEMS by Inkjet Enhanced Technologies,” or ...

May 15th 2013
Over the last several years, the semiconductor industry has made significant strides in...

May 14th 2013
Brewer Science, Inc.,broke ground on a new facility at the Rolla National Airport which...

May 6th 2013
EI's technology acts as the command center of a very small hit-to-kill interceptor ...

May 6th 2013
"After experiencing relatively mild 1.8 percent growth in 2011, the SATS market ...

May 2nd 2013
Silicon interposers that fit the "2.5D" definition will, within a year or ...

May 2nd 2013
Driven by consumer markets and mainly by smartphone products, embedded packaging ...

May 1st 2013
Advanced Semiconductor Engineering Inc (ASE), the world’s biggest chip packager, ...


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