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On one side, integration using through silicon vias (TSV) is a technology which is widely adopted in CMOS image sensor and MEMS manufacturing, allowing much smaller foot print. Toshiba, STMicroelectronics, Bosch, TSMC, mCube… are using such devices in high volume production. The drivers are ...


 
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The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration has focused on (a) reduced form factor in the X, Y, and Z dimensions, (b) more functions combined within a single package, and (c) improved electrical and thermal performance (reduced electrical and parasitic resistance and lower energy consumption)....

Source: 3D Packaging - Nov. 2012 - Amkor Technology special issue

 
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Feel free to download Thibault Buisson's presentation held at MiNaPAD 2014 ...

 
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Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global ...
 
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3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?...

 
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This is an example of three-layer DBI® hybrid bonding in a 3D imaging chip, using ...

On one side, integration using through silicon vias (TSV) is a technology which is ...

Plan Optik is responding to the increasing demand of a growing number of users for ...

Wafers and substrates are thinned down from as thick as 750 micron down to 25-50 micron...

The new high-density, high-performance module will play a key role in supporting the ...

STATS ChipPAC Ltd. (“STATS ChipPAC” or the ...

ADVANCED PACKAGING COMMITTEE  Papers are solicited on all topics ...

Until now the company has offered trial services of this kind to businesses and other ...

August 12th 2014
New generations of processors require more efficient interface formats that will enable...

By setting up in Jiangyin National High-Tech Industrial Development Zone, the joint ...

Novati Technologies Inc. (“Novati”), a leading development center for ...

Yole Développement (Yole) and National Center for Advanced Packaging (NCAP ...

In addition to the new patent license agreement, Tessera's wholly-owned subsidiary ...

At the April TSMC Technology Symposium in San Jose,  they described a wide range ...

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – ...


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