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Home  > ADVANCED PACKAGING: 3D IC, WLP & TSV
  > Advanced Packaging: 3D IC, WLP & TSV
 
  >  TOP STORY
TSMC plans 3-D IC assembly launch early in 2013
The technology is called COWOS internally, standing for chip on wafer on substrate and Marced said the company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS. TSMC is already working with companies on the use of silicon interposer ...

 
 
  >  ANALYSIS
3D investments are underway
Now that 3D investments are clearly underway and the technology is widely viewed as “inevitable,” it’s an ideal time to find out how key industry players—including EV Group, NEXX Systems, STATS ChipPAC, SUSS MicroTec, and Texas
Instruments—see the “mid-end” shaping up. Just one year ago, a vast range of diversity in 3D technologies were being ...

 
 
  >  INTERVIEW
Teramikros talks about joining the Tera Probe group, capacity plans
Japan-based Teramikros specializes in the manufacture of wafer-level packages. Mr. Shigeru Koshimaru, President of Teramikros, Inc. talks to Yole Développement in an exclusive interview, about becoming part of the Tera Probe group, how their combined synergies will be harnessed, and its plans to increase production capacity....
 
 
  >  REVERSE ENGINEERING
STMicroelectronics’ innovation in wafer-to-wafer bonding techniques shrinks MEMS die size and cost!
Glass-frit bonding ST is used to protecting its inertial sensors (accelerometers and gyroscopes) with a cap wafer
which is bonded using a glass-frit wafer bonding process....

 
 
  >  PRESENTATION
3DIC & TSV Interconnects - Market update & infrastructure readiness
To learn more about the 3DIC & TSV interconnects, read Jeff Perkins presentation on 3D RTI, Dec. 2011 ...
 
 
  >  LATEST REPORT
WLCSP Market & Industrial Trends
Wireless industry drives WLCSP market to an over B1$ worth package platform...
 
 
  >  EVENTS
Semicon Korea
No other event in Korea gives you access to more leading microelectronics companies in the region than SEMICON Korea. ...
 
 
  >  TECHNOLOGY MAGAZINE
 
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November 2011

September 2011
 
  >  NEWS
February 4th 2012
In a conference call following release of Novellus Systems’ fourth quarter and ...

February 2nd 2012
The good news is Jedec released in early January an initial standard for Wide I/O ...

February 1st 2012
This structure achieves further enhancement in image quality, superior functionalities ...

January 27th 2012
For the last 3D Thursday blog post of 2011in the EDA360 Insider, I thought I’d ...

January 25th 2012
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced ...

January 19th 2012
Currently, the company is evaluating the technology by using TEG (test element group), ...

January 19th 2012
During a Q&A session at TSMC's investors meeting on January 18, Morris Chang, TSMC ...

January 19th 2012
This major announcement is the first one concerning a product release using this long ...

January 19th 2012
2.5D before 3D Advances in manufacturing and packaging technologies have already...

January 18th 2012
In lieu of a conventional ion beam gun, the Bond Meister MWB-12-ST adopts a fast atom ...

January 18th 2012
TSVs (through-silicon vias) connect these three die together and “in order to ...

January 18th 2012
In late 2008, Si2 established a strategic industry alliance with GSA, with an initial ...

January 18th 2012
Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working ...

January 18th 2012
The IC industry is always challenging for thinner packages with smaller footprint. ...

January 18th 2012
3D integration is introducing several new process steps primarily on the wafer backside...

More Advanced Packaging news
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