The technology is called COWOS internally, standing for chip on wafer on substrate and Marced said the company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS.
TSMC is already working with companies on the use of silicon interposer ...
Now that 3D investments are clearly underway and the technology is widely viewed as “inevitable,” it’s an ideal time to find out how key industry players—including EV Group, NEXX Systems, STATS ChipPAC, SUSS MicroTec, and Texas
Instruments—see the “mid-end” shaping up. Just one year ago, a vast range of diversity in 3D technologies were being ...
Japan-based Teramikros specializes in the manufacture of wafer-level packages. Mr. Shigeru Koshimaru, President of Teramikros, Inc. talks to Yole Développement in an exclusive interview, about becoming part of the Tera Probe group, how
their combined synergies will be harnessed, and its plans to increase production capacity....
Glass-frit bonding ST is used to protecting its inertial sensors (accelerometers and gyroscopes) with a cap wafer
which is bonded using a glass-frit wafer bonding process....
To learn more about the 3DIC & TSV interconnects, read Jeff Perkins presentation on 3D RTI, Dec. 2011 ...
Wireless industry drives WLCSP market
to an over B1$ worth package platform...
No other event in Korea gives you access to more leading microelectronics companies in the region than SEMICON Korea. ...
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In a conference call following release of Novellus Systems’ fourth quarter and ...
The good news is Jedec released in early January an initial standard for Wide I/O ...
This structure achieves further enhancement in image quality, superior functionalities ...
For the last 3D Thursday blog post of 2011in the EDA360 Insider, I thought I’d ...
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced ...
Currently, the company is evaluating the technology by using TEG (test element group), ...
During a Q&A session at TSMC's investors meeting on January 18, Morris Chang, TSMC ...
This major announcement is the first one concerning a product release using this long ...
2.5D before 3D
Advances in manufacturing and packaging technologies have already...
In lieu of a conventional ion beam gun, the Bond Meister MWB-12-ST adopts a fast atom ...
TSVs (through-silicon vias) connect these three die together and “in order to ...
In late 2008, Si2 established a strategic industry alliance with GSA, with an initial ...
Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working ...
The IC industry is always challenging for thinner packages with smaller footprint. ...
3D integration is introducing several new process steps primarily on the wafer backside...