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Andy has more than 28 years experience in semiconductor and related high technology ...




Jenoptik and 3D-Micromac AG announce the technology transfer of thermal laser ...




Oxford Instruments is offering an upgrade option for its ALD equipment to apply a bias ...




EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the ...




EUROPE – KNOWING ABOUT ITS STRENGTHS Europe’s semiconductor industry...




We have some exciting news for you: we’re launching a new ...




While cost remains the single most important aspect of back-end advanced packaging, ...




SPTS Technologies, a supplier of advanced wafer processing solutions for the global ...




December 17th 2013
«Bringing closer Design, Semiconductor, Assembly & Packaging communities ...




Building on the success of the 1st edition that attracted almost 320...




"Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D ...




December 13th 2013
Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to ...




Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D ...




CEA-Leti announced an agreement with Qualcomm Technologies, Inc., a subsidiary of ...




Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) ...





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