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Latest Publication
TDK-EPC P8009 Module with Maxim Embedded Dies
One of the few high volume 3D embedded dies package - Latest evolution of the TDK SESUB Process
Publication date :
June 2013
Teardowns & Reverse Costing Analysis
Market & Technology Reports
New
Flexible Applications Based on Printed Electronics Technologies
New
Glass Substrates for Semiconductor Manufacturing
New
Flip-Chip Market and Technology Trends
New
Emerging Non-Volatile Memory
New
LED Packaging
New
FOWLP & Embedded Die Packages
New
Equipment & Materials for 3DIC & Wafer-Level-Packaging
New
Thin-Film IPDs
New
Thin Wafers, Temporary Bonding Equipment & Materials Market
New
3D Glass & Silicon Interposers
New
3DIC & TSV Interconnects 2012 Business Update
New
Deep Reactive Ion Etching
New
Polymeric Materials for 3DIC & WLP Applications
New
MEMS Packaging
New
WLCSP Market & Industrial Trends
New
Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate
New
3D TSV Technologies Scenarios: Via First or Via Last? 2010 report
Patent Analysis
New
2.5D, 3DIC and TSV Interconnect Patent Investigation
New
FOWLP Patent Analysis
Teardowns & Reverse Costing Analysis
New
TDK-EPC P8009 Module with Maxim Embedded Dies
New
Nokia Lumia 920 - Camera Module with OIS
New
Rohm DC/DC Micro Converter TDK-EPC Embedded Die Process
New
Nemotek Wafer-Level Camera Shellcase®
New
Apple iPhone 4 Camera Module
New
Apple iPhone 4S Camera Module
New
Nokia 2330 Camera Module - STMicro VGA CIS WLP Heptagon WL-Optic -
New
Nokia 2330 Camera Module -Toshiba VGA CIS WLP Anteryon WL-Optic-
New
Omnivision OVM7692 Camera Module
New
Samsung Galaxy S II Camera Module
New
Sony Ericsson Cyber-shot S006 Camera Module
New
Texas Instruments Embedded Die Package
New
EWLP from Casio Micronics Fujitsu WL-CSP 309-pin Reverse Costing Analysis
New
Infineon Fan-out WLP Reverse Costing Analysis
Cost Simulation Tools
New
TSV CoSim+
Contact Sales Department
David Jourdan, Yole Développement
jourdan@yole.fr
Faycal El Khamassi, Yole Développement
khamassi@yole.fr
MEMS
ADVANCED PACKAGING: 3D IC, WLP & TSV
COMPOUND SEMI
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