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Home  >  COMPOUND SEMI  > MATERIALS & EQUIPMENT NEWS
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  >  MATERIALS & EQUIPMENT NEWS
 
World's first direct bonding of SiC-Si and GaN-Si at room temperature achieved by MHI bonding machine -- Leads way for new device
Realized by a room-temperature wafer bonding machine developed by MHI which enables highly efficient, high-quality bonding of these materials, the achievement promises possibilities for various applications. MHI's roomtemperature bonding machine will further facilitate and ...
 
IMEC’s GaN-on-Si research program adds Micron, Applied and Ultratech
Launched in July 2009, the multi-partner R&D program focuses on the development of GaN-on-Si process and equipment technologies for manufacturing solid-state lighting (e.g. LEDs) and next-generation power electronics components on 8-inch silicon wafers, aiming to reduce ...
 
Scottish university spins off microLED firm
Strathclyde University, UK, has secured a spin-out deal to form a company called mLED. The firm will pioneer the future advancement of microLED arrays, a technology that was developed in the university's Institute of Photonics which could find uses in applications such as ...
 
EpiWorks demonstrates 6-Inch CS-based PV solar production
The company points out that the demonstration is the first step in establishing the infrastructure and capability to produce low-cost solar cells with the highest conversion efficiency.

“We are a high-tech manufacturer with an established track record ...
 
Nitride materials maker Kyma to expand with debt financing from NRDA
Kyma has doubled its staff over the past two years and is running out of expansion space in its current facility on Midway West Road. A second facility within a mile of its headquarters was recently leased and will be used to house the firm’s back-end processing line. ...
 
IQE announces 6" wafer capability for CPV applications
IQE has been supplying the global chip industry as a pure-play contract manufacturer for more than two decades and is established in GaAs-based epiwafer products for wireless applications including RF components for mobile phone handsets. The group, which has manufacturing ...
 
Rohm acquired additional 25% stake in SiCrystal
Rohm Co. Ltd. acquired additional 25% stake in SiCrystal AG from S-REFIT Regionaler Finanzierungsfonds für Innovationen und Technologieunternehmen and other private investors on April 1, 2010....
 
Riber reports Q1 revenue up 11% year-on-year
This was despite delivering the same number of research machines as in Q1/2009 (two) – representing systems sales down 8% from €1.2m a year ago to €1.1m - and sales of cells and sources falling 57% to €0.2m compared to Q1/2009's exceptionally high €0....
 
Umicore completes construction of new US germanium substrates production facility
The 40,000 square foot facility is now undergoing process start-up and qualification runs. The new substrate facility is located on the same campus as the Umicore germanium optics and high purity chemicals operation for the US market and will be integrated in the existing ...
 
TDI wins $600K to boost production of SSL materials
This Clean Energy Economic Development Initiative award will enable TDI to hire three new scientists and engineers in 2010 and put it on track to create dozens more direct and indirect Maryland high-tech jobs by 2015. The award will help complete materials and process ...
 
IQE's Wafer Technology division extends GaSb substrate range to 4"
GaSb materials are used in the manufacture of a wide range of products including infrared laser diodes, detectors and thermophotovoltaic (TPV) cells that can convert infrared (heat) energy into electrical power.

The firm says that 4" GaSb-Te wafers are now ...
 
Kyma wins $2.8m DoD funding for low-defect GaN development
This funding (included in the Fiscal Year 2010 Department of Defense Appropriations Bill) will support Kyma's ongoing efforts to make bigger and more cost-effective bulk GaN substrates, which are needed for multiple next-generation defense systems as well as several major ...
 
White LED demand 'faces challenge of MOCVD tool backlog'
White light emitting diode (LED) demand will increase with the announcement by Apple of its iPad, placing pressure on their tight supply and backlog in the order of metal-organic chemical vapour deposition (MOCVD) tools, it has been claimed.

Analyst Munisamy ...
 
Key milestone for graphene wafers
Graphene is an ideal candidate for many high-speed computing applications in the multibillion-dollar semiconductor device industry. The researchers found an electron moved at 1/300th the speed of light through graphene - potentially enabling terahertz computing, at processor ...
 
Cascade Microtech acquires test systems division of SUSS MicroTec AG
Cascade Microtech (NASDAQ:CSCD) announced that it has acquired the semiconductor test systems business of SUSS MicroTec AG., a German public company. The test systems business specializes in wafer-level test solutions for devices under test (DUT), and strengthens Cascade ...
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