<?xml version='1.0' encoding='iso-8859-1'?><rss version='2.0'><channel><language>en</language><copyright>Copyright 2007, Yole Developpement</copyright><title><![CDATA[I-micronews - ICMan]]></title><link>http://www.i-micronews.com/thematique.asp?them=6</link><description><![CDATA[SEMICONDUCTOR MANUFACTURING]]></description><lastBuildDate>Saturday, 18 May 2013 02:29:37</lastBuildDate><item><title><![CDATA[TranSiC: Fairchild Semiconductor acquires the Swedish power transistor company, pays USD 17 million]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=6869</link><pubDate>Thursday, 5 May 2011 15:45:44</pubDate><description><![CDATA[Answering the need for increasing efficiencies and higher performance for semiconductor applications, Fairchild Semiconductor (NYSE: FCS) is extending its technology leadership capabilities with the acquisition of TranSiC, a Silicon Carbide (SiC) power transistor company.]]></description></item><item><title><![CDATA[SIA Forecast 2009 - 2011]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3732</link><pubDate>Monday, 16 Nov 2009 14:20:31</pubDate><description><![CDATA[The Semiconductor industry Association (SIA) released its annual forecast of global semiconductor sales projecting worldwide sales of $219.7 billion for 2009, a decline of 11.6 percent from the $248.6 billion reported in 2008. The forecast projects ...]]></description></item><item><title><![CDATA[SMIC Settles All Pending Lawsuits with TSMC: Anticipates No Disruption to Customers]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3755</link><pubDate>Monday, 16 Nov 2009 14:20:31</pubDate><description><![CDATA[Semiconductor Manufacturing International Corporation (the "Company" or "SMIC") announced that it entered into a settlement agreement with Taiwan Semiconductor Manufacturing Company, Ltd. (the "Acquiror" or "TSMC") to resolve all pending lawsuits ...]]></description></item><item><title><![CDATA[Silicon wafer shipments grow in 3rd quarter 2009]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3724</link><pubDate>Thursday, 12 Nov 2009 10:41:24</pubDate><description><![CDATA[Worldwide silicon wafer area shipments increased significantly during the third quarter 2009 when compared to the second quarter 2009 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon ...]]></description></item><item><title><![CDATA[TI opens world's most advanced analog manufacturing facility in the U.S.]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3582</link><pubDate>Friday, 2 Oct 2009 10:45:27</pubDate><description><![CDATA[Facility will increase volume of energy-efficient chips for customers and create new jobs in North Texas]]></description></item><item><title><![CDATA[X-FAB Announces Half-Year Results]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3551</link><pubDate>Friday, 18 Sep 2009 10:14:20</pubDate><description><![CDATA[X-FAB Silicon Foundries announced sales of USD 84.4 million (EUR 63.3 million) for the first six months of the current fiscal year. This corresponds to a year-on-year decline of approximately 62.7 percent. Sales in the second quarter amounted to USD ...]]></description></item><item><title><![CDATA[CEA-Leti and MAPPER to Launch “IMAGINE” Program with Delivery Of MAPPER’s Massively Parallel Electron Beam Platform ]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3374</link><pubDate>Monday, 24 Aug 2009 17:35:11</pubDate><description><![CDATA[&nbsp;CEA-Leti and MAPPER Lithography announce today that MAPPER has delivered one of its massively parallel electron beam platforms to CEA-Leti. 
This delivery is part of the collaboration program between MAPPER and CEA-Leti targeting development ...]]></description></item><item><title><![CDATA[Replisaurus and Leti partner to drive innovative metallization technology into final stages]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3295</link><pubDate>Tuesday, 7 Jul 2009 10:55:37</pubDate><description><![CDATA[As company prepares clean ECPR technology for chip market, Leti collaboration will boost mastering fabrication process ]]></description></item><item><title><![CDATA[TSMC joins the CEA-Leti Program on multiple E-Beam lithography for IC manufacturing]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3293</link><pubDate>Tuesday, 7 Jul 2009 10:20:43</pubDate><description><![CDATA[TSMC and CEA-Leti, the leading French semiconductor research institute, signed an agreement in which TSMC will join the new industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC manufacturing. Intended to operate for three ...]]></description></item><item><title><![CDATA[X-FAB to Close 6-Inch Production at Plymouth, UK Fab]]></title><link>http://www.i-micronews.com/lectureArticle.asp?id=3282</link><pubDate>Tuesday, 30 Jun 2009 10:34:00</pubDate><description><![CDATA[Hi-tech firm's team at risk as orders fall; The future of semi-conductor manufacturer X-FAB's prized Plymouth factory was plunged into doubt last night as the firm warned it would close if not sold by the end of next year]]></description></item><item><title><![CDATA[Yole  distributes “world Electronic industries 2008 – 2013” report from DECISION. ]]></title><link>http://www.i-micronews.com/interview.asp?id=50</link><pubDate>Monday, 6 Apr 2009 11:57:30</pubDate><description><![CDATA[Yole  distributes “world Electronic industries 2008 – 2013” report from DECISION. Yole already diversified its reports offer with the distribution of Chipworks reports in Europe and those of System + consulting. With the distribution of DECISION's ...]]></description></item><item><title><![CDATA[Through continuous innovation, EVG is well determined to keep its leadership position for the next years]]></title><link>http://www.i-micronews.com/interview.asp?id=6</link><pubDate>Friday, 13 Jul 2007 11:51:00</pubDate><description><![CDATA[Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets....]]></description></item></channel></rss>
