To download the latest issue
SPP Process Technology Systems (SPTS) promotes Kevin Crofton to Chief Operating Officer
SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch and deposition, and thermal processing equipment for the semiconductor industry today announced the promotion of Kevin Crofton as its Chief Operating Officer (COO). Mr. Crofton was serving as the ...
EV group advances SOI leadership and presence in China with first order from SOI supplier Shenyang Silicon Technology
The China-U.S. joint venture firm will utilize the EVG850LT, which was shipped in September 2010, in its state-of-the-art SOI production facility to expedite its efforts to ramp up high-volume manufacture of SOI wafers.
According to SST President Hai Fengtao, ...
Oxford Instruments and ITRI jointly establish research center for WLP and LED packaging development
In the future, the new technologies could be transferred to Taiwan-based LED chip packaging houses to strengthen Taiwan's LED industry. Silicon substrate packaging technology on the island should see a significant breakthrough in the near term.
PVA TePla AG: Key figures for fiscal year 2010
Incoming orders of EUR 93 million (previous year: EUR 69.0 million) Order backlog of EUR 53 million (previous year: EUR 87.8 million).
PVA TePla AG, Wettenberg, a manufacturer of silicon crystallization systems as well as vacuum and high-temperature systems, ...
memsstar experiences strong growth in 2010
memsstar Limited, a leading provider of equipment and process expertise to the micro-electrical mechanical systems (MEMS) and semiconductor industries, today announced that it more than doubled its new orders in 2010 to more than US $20 million. memsstar’s sales were ...
SPTS ships APS etch system to Fraunhofer ISIT
The system will add new process capability to ISIT’s MEMS manufacturing line to fuel next generation development of devices such as actuators, sensors and energy harvesters. “We have chosen to add APS to extend our offerings to the full range of deep etch ...
Tegal expands ProNova(TM) ICP silicon DRIE reactor family with introduction of the ProNova2(TM)
This week at SEMICON Japan, Tegal Corporation /quotes/comstock/15*!tgal/quotes/nls/tgal (TGAL 0.50, +0.01, +1.03%) , an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and 3D ICs, will launch the newest member of its popular ...
PVA TePla publishes forecast for 2011 and confirms forecast for 2010
An EBIT margin of 8-10% is expected. • Expected consolidated sales revenues of EUR 120-130 million in 2011
• 2011 operating EBIT margin likely to be in the ...
SPP Process Technology Systems (SPTS) celebrates one year anniversary
SPP Process Technology Systems (SPTS), a subsidiary of Sumitomo Precision Products Co., Ltd. (SPP), celebrates one year since it began operations in November 2009, while opening its new San Jose office. The new facility serves as home to SPTS’ Thermal Products Division ...
SUSS MicroTec and Fraunhofer IST introduce new technology for selective surface treatment
Local treatment of the surface prior to wafer processing replaces standard process steps and reduces the overall cost per wafer. Selective plasma activation can be applied to a variety of MEMS, optical and solar applications using direct wafer bonding or surface modification ...
Tegal gets repeat order for 3200 SE DRIE process module
In a release, the company said the Tegal 3200 SE DRIE process module will be shipped and installed at the customer's site in early CY2011, and will support the customer's plans for ramping production capacity for High Volume Manufacturing of MEMS image sensors.
EV GROUP announces 20%+ increase in revenue
In fact, the company reports it has grown, on average, approximately 20 percent year-over-year since 2003-successfully avoiding a drop in order intake and revenue even in 2008 and 2009 despite the global economic recession.
According to Hermann Waltl, EVG's ...
EVGroup realizes continued growth for fiscal year on top of an already successful prior year
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and ...
EVG unveils EVG520L3 next-generation wafer bonding system with key cost-of-ownership advantages for advanced packaging and MEMS application
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its industry-leading EVG500 Series of ...
Bosch selects Zeta Instruments Zeta-200 imaging and metrology solution for R&D activities
The leading global supplier of technology and services chose Zeta's 3D surface imaging and metrology solution to meet the rigorous measurement requirements associated with a range of Bosch R&D activities, including photovoltaics and MEMS (Micro-Electro-Mechanical-Systems) ...
More MEMS EQUIPMENT news