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MediaTek announced the launch of its MediaTek Helio P25, the newest addition to the MediaTek Helio P series mobile processor family. The new chipset combines the power of 16nm Octa-core processing with MediaTek Imagiq - a superior Image Signal Processor (ISP) technology - and dual camera features to satisfy smartphone photographers.

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USound and Fraunhofer Institute develop micro-speaker with innovative MEMS technology. Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the first based on micro-electro-mechanical systems (MEMS).

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Samsung announcing its participation in the Audi Progressive SemiConductor Program as a partner supplier of Exynos processorsfor Audi’s In Vehicle Infotainment system. Samsung Electronics, a world actor in advanced semiconductor technology,announced its participation in the Audi Progressive SemiConductor Program (PSCP) as a partner supplier of Exynos processors, its own System-on-Chip (SoC) solution, for Audi’s In Vehicle Infotainment (IVI) system.

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2016 was a year of strong consolidation in the semiconductor industry, with many acquisitions in a wide variety of fields along with enormous transactions worth several billions of dollars. 2017 seems to be following the same path, with recent announcements in the advanced packaging industry that are motivated by the recent focus on innovative platforms like fan-out packaging.

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Amkor Technology and NANIUM S.A. announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.

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At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world research and innovation hub for nano-electronics and digital technology imec and the supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. 

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