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Home  > ADVANCED PACKAGING
  > Advanced Packaging: 3D IC, WLP & TSV
 
  >  TOP STORY
GLOBALFOUNDRIES adds tools to enable 3DIC for next-gen mobile and consumer applications
At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company’s leading-edge 20nm technology platform. The TSV capabilities will allow customers to stack...

 
 
  >  ANALYSIS
Demand for wafer-level chip-scale packages accelerates
Wafer-level chip-scale packages (WLCSPs) are by no means the lowest-cost solution available, but its tiny volume and electrical performance benefi ts are turning it into the “go-to” package for use in mobile phones and tablets....

Source: 3D Packaging Feb. 2012 – Powered by Yole Développement
 
 
  >  INTERVIEW
High tech thermal solutions coming from southern Germany for the world market
ERS is a German company, founded in 1970 and specializing in thermal solutions for the semiconductor industry. Calling itself a “research & development company with a large production capacity” ERS participates actively in semiconductor industry events and welcomes thermal challenges that defy standard solutions. In 2008, engineer Klemens Reitinger took over the company from its founder Erich ...
 
 
  >  REVERSE ENGINEERING
OmniVision’s VGA wafer-level camera
Whether it’s for the main camera of low-cost phones or the front-facing camera of high-end phones, low-cost, low-resolution camera modules are extremely important....

Source: 3D Packaging Feb. 2012 - Powered by Yole Développement
 
 
  >  LATEST REPORT
Deep Reactive Ion Etching
The number of wafers processed with DRIE will see 5X growth 2011 – 2017...
 
 
  >  PRESENTATION
Analysis of innovation trends in packaging for power modules
Feel free to download Jean-Marc Yannou's presentation held at the 7th European Advanced Technology Workshop on Micropackaging and Thermal Management ...
 
 
  >  YOLE DEVELOPPEMENT EVENTS
Connect in 3D
The Connect in 3D Collaboration Summit is an unprecedented networking event engineered for the global supply system dedicated to 3D integration of IC chips in devices. Not just another meet-and-greet, this is a powerful, innovative game-changing event for networking and collaboration. Connect in 3D provides a two-day platform to meet, learn, talk, and ultimately collaborate in a time-efficient and ...
 
  >  TRADE SHOWS & CONFERENCES
IEEE Workshop 
on Low Temperature Bonding for 3D Integration
This workshop will focus on low-temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems. ...
 
 
  >  TECHNOLOGY MAGAZINE
 
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  >  NEWS
May 15th 2012
Typical encapsulation technologies include: glob top, underfilling, transfer molding ...

May 11th 2012
Yole Développement announces its report “Polymeric Materials for 3DIC ...

May 10th 2012
“3D IC test wafers will run this year and high-volume 3D IC manufacturing will ...

May 10th 2012
Here, at the junction of advanced design, process technology and state-of-the art ...

May 10th 2012
If you think of SoC silicon as a stack, the lowest layer is where you'll find the ...

May 10th 2012
Carsem has successfully assembled and qualified High Brightness Silicon Substrate LED ...

May 9th 2012
Last October, memory rivals Samsung and Micron announced the creation of a consortium ...

May 2nd 2012
Only a smattering of 2.5D/3D chips have been announced and shipped in the market today....

May 2nd 2012
Even before finFETs, there are also questions about the 20nm node at the foundries. And...

April 25th 2012
Today nearly all electronic devices are built on complementary metal-oxide ...

April 25th 2012
"3-D affords the capability of integrating FPGAs with ASICs, with memory with ...

April 24th 2012
Drawing the analogy of the human brain, the company's niche buffer memory products act ...

April 19th 2012
SunPower invested an undisclosed amount of capital in Deca when the packaging house ...

April 17th 2012
The IC industry must embrace — and become more active — in the standards ...

April 17th 2012
ChipMOS has set aside a 2012 capex budget of NT$2 billion (US$67.8 million), with 70% ...

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