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Nexus 6P Fingerprint Sensor Fingerprint Cards FPC1025
Jan.2016

nexus_6p_fingerprint_icon
2 990 €

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Description

iphone6Sfingerprint flyerIn Google’s Nexus 6P, Huawei integrates again an innovative fingerprint sensor developed by Fingerprint Cards

The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.

The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.

SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.

Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.
The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.
The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.

The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.

This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons.

 Nexus 6P Fingerprint img

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction

 

Company profile & Supply Chain


 

Physical Analysis


> Physical Analysis Methodology
> Fingerprint Button assembly
  - Fingerprint Scanner Views
  - Fingerprint Scanner Cross-Section
  - Fingerprint Scanner Patents

> Sensor Die

  - View, Dimensions & Marking
  - Sensor Die Capacitors
  - Sensor Die Edge Contact
  - Sensor Die Delayering & main Blocs
  - Sensor Die Process
  - Process & Cross-Section
  - Sensor Die Process Characteristic

ASIC
  - Dimension & Marking
  - Delayering & process identification    
  - IC process  

  - Die Cross-Section

                                                                                                                                               

Comparison Nexus 6P’s vs Ascend Mate 7’s fingerprint sensor


 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow

> Sensor Die Front-End Process
> LGA Packaging Process
> Sensor Die Front-End Process
> Final Test & Packaging
Fabrication unit
Synthesis of the main parts

 

Cost Analysis


> Sensor Die Front-End Cost, Probe Test, Thinning & Dicing
> LGA Packaging Cost
> Sensor component cost
>ASIC Die Front-End Cost, Probe Test, Thinning & Dicing
> ASIC die cost
>Assembled Components Cost

> Synthesis of the assembling
> Fingerprint Component Cost

                                              

Technology and Cost comparison with Huawei’s Ascend Mate and Samsung 6S fingerprint sensors


 

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click  here .

 

 

 

 

 

 

 

 



REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison with Huawei Ascend Mate 7 fingerprint sensor

  • Comparison with Apple and Samsung fingerprint buttons