Description Power packaging adds great value to power electronics: power packaging will represent a $1.7B market by 2020, 30% of the power module marketPOWER MODULE PACKAGING PERFORMANCE IS NOW ESSENTIAL IN MEETING MARKET NEEDS
In order to increase power module yield and reliability, companies are working on new products for power packaging, especially for the common failure locations, die and substrate attach, interconnection and encapsulation. Both new designs and new materials can be used, whether to eliminate levels of connection or to improve interfaces. In die attach, for instance, soldering is progressively losing market share, which benefits silver sintering. Although the basic material is more expensive, taking into account cheaper equipment and manufacturing costs and improved reliability, this technology is seducing ever more players. Standard wire bonding is evolving as well, with solutions increasing contact surface, such as ribbon or ball bonding. Encapsulation technologies must evolve to handle high operating temperatures: standard silicone gel or epoxy are limited in terms of temperature, and so new materials such as parylene are being developed.
Developments for power packaging are needed because power electronics is facing many challenges, due to both environmental and technical requirements. Increasing power density and power conversion optimization for CO2 emission reduction are key. To achieve ambitious governmental targets and to respect volume constraints, technology breakthroughs are needed at device and module level. Moreover, the growing and important role of wide band gap (WBG) semiconductors makes efficient packages mandatory, so that devices’ high frequency, high voltage or high temperature capabilities can be best exploited.
Growth of electric vehicles and hybrid electric vehicles (EV/HEV) will drive the power electronics market in the coming year. That brings particular requirements, like size and cost constraints, large production volumes, and ability to automate assembly. Packaging improvements will go with these specific requirements.
Applications also increasingly need to work at high voltage or high temperature. Innovations are also needed so that system packages can support harsh working conditions.
In this report you will find detailed descriptions of standard power module packaging designs. There are special focuses on each part: substrate, thermal interface materials, baseplate, encapsulation, die attach and interconnection. Both technological and marketing points of view are considered. Technological innovations are presented, and market metrics and forecasts are given for each part.
POWER PACKAGING MARKET WILL REACH $1.7B IN 2020
A few years ago, the power electronics market was still quite small, with few applications that had specific needs. Nowadays, it’s much more common to need power electronics devices, with fields such as electricity transmission and distribution, for example, now equipped with them. The main motivation behind this important change is increasing yields and reducing CO2 emissions, in order to fit with governmental targets. In coming years Yole expects a high annual growth rate of +7% between 2014 and 2020 for devices, from $11.5B to $17.2B for the market, driven mainly by huge development in EV/HEV and expansion in renewable energy. Each segment of power electronics will grow, from the single device market to final systems. Geographically, Asia still led demand in 2014, and we expect this trend to continue thanks to very ambitious targets from Chinese Government.
The power packaging market is also growing, pulled by the interconnection and substrate segments, respectively +14% and +13% between 2014 and 2020. Global growth for raw material is expected to reach +12% between 2014 and 2020, with a global market of $1.7B for 2020. In this report you will find detailed market metrics and analysis for the power electronics field in 2014, split by application, technology and area, and market metrics and forecasts for power packaging market between 2014 and 2020 based on surface area or unit volume, and market value in dollars.
WHAT ABOUT THE SUPPLY CHAIN: VERTICAL INTEGRATION IS PROGRESSING
In order to increase performance and to reduce losses, more and more power electronics applications choose to use power modules instead of discrete components. In this context mastering power module assembly is mandatory for manufacturers. Power module manufacturing becomes a key step and a hotly contested area between device makers and inverter makers. The main trend for power module makers is sourcing package materials from specialized companies and to assemble the module in-house.
Developing new designs is also a good business development opportunity for small companies or start-ups, even if for many fields regional preferences still exist.
The Chinese supply chain is developing strongly, with increasing vertical integration thanks to recent acquisitions and knowledge evolution in house.
Different types of business model are presented in this report, as well as specialized companies for each part of the final package.
PACKAGING FOR DISCRETE POWER DEVICES: TECHNOLOGIES TO WATCH
For a long time discrete devices were packaged quasi-exclusively in TO packages, which are mature and widespread packages able to handle high intensities. But many developments are ongoing for discrete components: surface mounted devices (SMD) are becoming increasingly common. SMD usually can’t be used at intensities as high as TO components, but they can achieve this range of performance when mounted in parallel. Moreover, for large volume applications such as EV/HEV SMD brings a possibility of being assembled automatically, which is a huge advantage. At Yole we expect this application to drive the market strongly, and then SMD to take a progressively bigger part in the power electronics industry.
There is also a trend to adapt advanced packaging trends such as wafer level packaging or embedded dies to power electronics by increasing the voltage and intensities they tolerate. Yole is following those developments closely, as well as the evolution of WBG semiconductor packaging. Detailed descriptions of technological solutions, case studies and trends are provided in this report.