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The first company to introduce laser assisted debonding was  3M whose WSS (wafer support system) process has been described in detail previously [see “New temporary bonding solutions revealed at SUSS 3D Workshop”]. HD Micro has also developed a process based on their 3000 series ...


 
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The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration has focused on (a) reduced form factor in the X, Y, and Z dimensions, (b) more functions combined within a single package, and (c) improved electrical and thermal performance (reduced electrical and parasitic resistance and lower energy consumption)....

Source: 3D Packaging - Nov. 2012 - Amkor Technology special issue

 
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Feel free to download Thibault Buisson's presentation held at MiNaPAD 2014 ...

 
  >  YOLE DEVELOPPEMENT EVENTS
Yole Développement and NCAP organize an Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology in Wuxi on August 28th, 2014. The seminar includes presentations on interposer & 3D integration, sensors & MEMS technologies and Si Photonics. Yole Développement shall detail the technology roadmap and give a market outlook. The Panel discussion will end the day. ...

 
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Is a symposium for engineers and product developers highlighting the latest advancements in thermal technology for product design, electronics, system development and process management ...
 
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3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?...

 
  >  NEWS

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – ...

Yole Développement and NCAP organize an Advanced Packaging Seminar focused on ...

Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new ...

It will be our pleasure to welcome you to the 5th Electronics ...

The first company to introduce laser assisted debonding was  3M whose WSS (wafer ...

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing ...

SPTS Technologies, a supplier of advanced wafer processing solutions for the global ...

The PlasmaPro100 Estrelas with Brooks wafer handler offers highest process performance ...

All results are part of the new report 3DIC & 2.5D TSV Interconnect for Advanced ...

USHIO INC. (TOKYO: 6925) (President and CEO: Shiro Sugata) announced that at SEMICON ...

BroadPak, the leading provider of 2.5D/3D integration technologies and comprehensive ...

Most in the industry are in agreement that scaling past the 22nm node, while still ...

On a standalone basis, SPTS is expected to ...

Mid-June, I-Micronews proudly presented a Plasma-Therm webcast, entitled “Can ...

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the ...


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