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EV Group unveils room-temperature covalent bonder for engineered substrate and power device production applications

EVG®580 ComBond® integrates advanced surface preparation processing to ensure oxide-free bonds and higher device yields.

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®-a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.

Read more: EV Group unveils room-temperature covalent bonder for engineered substrate and power device...

OmniVision's new flagship 16-megapixel sensor empowers next-generation of high-resolution mobile imaging

PureCel-S™ OV16850 sensor delivers high resolution images and video in native 16:9 aspect ratio for ideal user experience.

OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, announced the OV16850, a new flagship 16-megapixel imaging solution designed for the next generation of premium smartphones. Using a best-in-class 1.12-micron pixel and leveraging OmniVision’s stacked die technology, the PureCel-S™ OV16850 captures high resolution images and video in native 16:9 aspect ratio, optimizing users’ viewing experience on smartphone displays.

Read more: OmniVision's new flagship 16-megapixel sensor empowers next-generation of high-resolution mobile...

SUSS MicroTec launches SB6/8 Gen2: a next-generation semi-automated permanent wafer bonder

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder. The semi-automated SB6/8 Gen2 is SUSS MicroTec’s state-of-the-art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.

Read more: SUSS MicroTec launches SB6/8 Gen2: a next-generation semi-automated permanent wafer bonder

“Collaborative innovation across the supply chain is necessary for the development and commercialization of advanced packaging technologies”… says NCAP


Both partners, National Center for Advanced Packaging (NCAP China) and Yole Développement (Yole) confirm the success of their collaboration, with the 2014 Advanced Packaging & Integration Technology Symposium. This event is the first step of a promising collaboration between both organizations. “Such success was possible thanks to the great collaboration with NCAP, presentations and active participation of the audience”, says Yole.

Read more: “Collaborative innovation across the supply chain is necessary for the development and...

Advanced packaging technologies are changing the LED manufacturing supply chain

Last month, Yole Développement (Yole) announced the update of its technology and market analysis, LED Packaging Technology & Market Trends. Under this new report, the research market and strategy consulting company highlights the impact of advanced packaging technologies in the LED industry. “The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain”, announces Yole.

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Emerging DRAM architectures: a closer look

From Phil Garrou for Yole Développement - Sept. 29, 2014. Since emerging DRAM architectures offer different approaches to bandwidth (BW), power consumption and density. iMicronews thought that a comparison of technologies was worth....A Closer Look.

The challenges for DRAM are to:, (1) reduce power consumption, (2) satisfy bandwidth requirements and (3) satisfy density (miniaturization) requirements all while maintaining low cost .

Read more: Emerging DRAM architectures: a closer look