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Growth of the FOWLP applications: STATS ChipPAC shared its experience with Yole Développement team

STATS ChipPAC is now the world leader in the packaging of devices using FOWLP, with a good existing customer base and a very strong pipeline of projects. As published in the new report from Yole Développement "Fan-Out and Embedded Die: Technologies & Market Trends", Yole analysts are expecting a growth of 30% per year for the next 5 years. At the early days, STATS ChipPAC and Nanium were the only players in that field; now multiple companies are willing to support this platform, including OSAT, specialized packaging house and even front end foundries.


Anjinamoto build up films for high density substrates: a closer look

Phil Garrou for Yole Développement. In the early 1990s, Ajinomoto started a project to develop an insulating film formulation, about a decade later (1999) ABF (Anjinamoto Build-up Film) was accepted by Intel and the rest of the CPU manufacturers for their high density substrates. iMicronews thought taking a look at the current status of ABF was worth....A closer Look.


SMIC achieves 8M pixel CIS production on 0.13-micron BSI with Cista

Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China, and Cista System Corp. a fabless semiconductor company that specializes in CMOS Image Sensors (CIS) and System on Chip (SoC) designs, have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively. Both sensors are based on SMIC's independently developed 0.13-micron BSI technology platform.


Fan-Out Wafer Level Packaging: with a $200M market in 2015, Yole is expecting 30% CAGR in the coming years …

“Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015. And the More than Moore market research and strategy consulting company, Yole expects 30% CAGR in the coming years. What can explain such a great potential?


TDK counts on lithography solutions from SUSS MicroTec

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received a large order for various lithography tools from TDK in Q4 2014.


IPDiA expands its high temperature (250°C) Silicon Capacitor lines, dedicated to MCM assembly modules, with new voltage ranges from 11 V to 450 V

IPDiA, world leader in 3D silicon passive components, is launching the ETSC (200°C) and EXSC (250°C) silicon capacitor ranges to expand its product offering to higher voltage MCM applications.



> Successful Semiconductor Fabless 2015
(November 4 - November 6, Paris, France)