webleads-tracker

 
Member Sign In
Email:  
Subscribe to Micronews and Technology Magazines Help?
T E C H N O L O G I E S
 MEMS
 COMPOUND SEMI
 LED
 IMAGING
 OPTO & PHOTONICS
 MEDTECH
 PHOTOVOLTAICS
 ADVANCED PACKAGING
 NANOMATERIALS
 POWER ELECTRONICS
Home  > ADVANCED PACKAGING
  > ADVANCED PACKAGING
 
  >  TOP STORY
AMS uses 3D Chip Technology for smartphone sensors
AMS is using this technology to its ambient light sensor devices and is planning to develop more highly integrated and smaller devices for the smartphone and cameras market. Austrian chip maker ams is applying through-silicon via (TSV) 3D IC fabrication technology to its ambient light sensor ...

 
  >  ANALYSIS
Could copper pillar change the ecosystem?
The future of bumping is copper, and that could change everything. Though originally developed at the IDMs, players from foundries to OSATs are now developing a variety of differing copper pillar and micro-bumping solutions for a range of customers, looking re-designing the substrate, weighing extending reflow vs scaling thermal compression bonding, and developing probe and test systems....

Source: 3D Packaging - May 2013 - Powered by Yole Développement

 
  >  INTERVIEW
Keeping up with the industry heavyweights
IBM may have invented flip chip and Intel may have brought it to the worlds microprocessors, but FCI, through its low cost processing technologies brought it to hand held products in the early 2000’s....
 
  >  REVERSE ENGINEERING
POSSUM die design as a low cost 3D packaging alternative
The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration has focused on (a) reduced form factor in the X, Y, and Z dimensions, (b) more functions combined within a single package, and (c) improved electrical and thermal performance (reduced electrical and parasitic resistance and lower energy consumption)....

Source: 3D Packaging - Nov. 2012 - Amkor Technology special issue
 
  >  PRESENTATION
3DIC & 2.5D Interposer applications, market trends and supply chain evolutions
Feel free to download Lionel Cadix's presentation held at 3D RTI 2012 ...
 
  >  TECHNOLOGY MAGAZINE
 
Download our latest magazines

New 
May 2013

February 2013
 
  >  LATEST REPORT
TDK-EPC P8009 Module with Maxim Embedded Dies
One of the few high volume 3D embedded dies package - Latest evolution of the TDK SESUB Process...
 
  >  NEWS

June 19th 2013
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and ...

June 12th 2013
“Taking MEMS to the next level” The MEMS forum is an exceptional ...

June 12th 2013
Alchimer, S.A., a leading provider of wet deposition technologies for dual damascene, ...

June 11th 2013
AMS is using this technology to its ambient light sensor devices and is planning to ...

June 6th 2013
USHIO INC., (TOKYO:6925) (President and CEO: ...

June 5th 2013
Today's package-on-package (PoP) structures are mainstream technology. Package to ...

June 4th 2013
The sign-off ready flows, jointly developed with the leading EDA providers, offer ...

May 31st 2013
The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, ...

May 29th 2013
The $20 billion flip chip market is poised for 9% CAGR to reach some $35 billion by ...

May 29th 2013
The new Flip Chip expansion will be ready for volume production in July 2013 and will ...

May 27th 2013
While a significant advantage over other packaging and interconnect options of the ...

May 24th 2013
The solution was brought to high volume market readiness in collaboration with Kulicke ...

May 22nd 2013
The new integration will focus on fast, automated verification of die-to-die ...

May 21st 2013
Yole Développement announces its 2.5D, 3DIC and TSV Interconnect Patent ...

May 18th 2013
Independent package development and assembly specialists Sencio BV is bringing an extra...


More 3DIC news
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr