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New generations of processors require more efficient interface formats that will enable greater memory bandwidth. In addition todays thinner notebook PCs are changing the memory package density requirements for portable electronics. Traditional SO DIMM is considered too big and bulky for these ...


 
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The trend toward 3D system integration in a small form factor has accelerated even more with the introduction of smartphones and tablets. Integration has focused on (a) reduced form factor in the X, Y, and Z dimensions, (b) more functions combined within a single package, and (c) improved electrical and thermal performance (reduced electrical and parasitic resistance and lower energy consumption)....

Source: 3D Packaging - Nov. 2012 - Amkor Technology special issue

 
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Feel free to download Thibault Buisson's presentation held at MiNaPAD 2014 ...

 
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Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global ...
 
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3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?...

 
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STATS ChipPAC Ltd. (“STATS ChipPAC” or the ...

ADVANCED PACKAGING COMMITTEE  Papers are solicited on all topics ...

Until now the company has offered trial services of this kind to businesses and other ...

August 12th 2014
New generations of processors require more efficient interface formats that will enable...

By setting up in Jiangyin National High-Tech Industrial Development Zone, the joint ...

Novati Technologies Inc. (“Novati”), a leading development center for ...

Yole Développement (Yole) and National Center for Advanced Packaging (NCAP ...

In addition to the new patent license agreement, Tessera's wholly-owned subsidiary ...

At the April TSMC Technology Symposium in San Jose,  they described a wide range ...

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – ...

Yole Développement and NCAP organize an Advanced Packaging Seminar focused on ...

Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new ...

It will be our pleasure to welcome you to the 5th Electronics ...

The first company to introduce laser assisted debonding was  3M whose WSS (wafer ...

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing ...


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