powered by:
yole développement

Slider home

GLOBALFOUNDRIES, Director, Package Architecture & Customer Technology (PACT) Rama Alapati to Keynote IWLPC 2015

Conference: High Density Fan-Out: Evolution or Revolution

Continued form factor and IO density scaling pressures have necessitated innovation in wafer level packaging technologies including High Density Fan-Out at leading edge Si nodes.

Read more...

UMC enters volume production for TSV Process used to enable AMD's high-performance Radeon R9 Fury X GPU

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, announced that it has entered volume production for the Through-Silicon-Via (TSV) technology used on the AMD Radeon™ R9 Fury X, the flagship GPU in the recently announced Radeon™ R 300 Series of graphics cards.

Read more...

Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.”

Read more...

Big potential for fan-out packaging

As a leading Korean semiconductor wafer level packaging solutions provider, nepes has been shipping automotive components packaged by FOWLP in HVM (High Volume Manufacturing) mode in accordance with German automotive makers’ qualifications.

Read more...

Compression molding for large area Panel Level Packaging: … a closer look

At the recent ECTC Conference in San Diego Tanja Braun and co-workers at Fraunhoffer IZM and Technical University of Berlin described their studies on the large area compression Molding for Fan-out panel level packaging. We thought it was worth…..a closer look

The Fraunhoffer IZM and Tech Univ Berlin researchers have been studying the large area (18 x 24”) compression molding of fan out packages. The large panel size equals a typical PCB manufacturing full format and is selected to achieve process compatibility with cost efficient PCB processes.

Read more...

Supply chain, market positioning, business opportunities and company value: what can we expect for the semiconductor industry? Successful Semiconductor Fabless 2015 (SSF 2015)

Successful Semiconductor Fabless 2015 - SSF 2015. From Nov. 4 to 6, 2015, Paris, France
Today, the semiconductor supply chain offers a lot of possibilities in terms of business models. Companies have many opportunities to develop their own components all across the market. They can develop designs, integrate software, focus on sensitive elements and propose dedicated packaging. There are many possibilities – but maybe just one way to optimize a company's value.

Read more...

UPCOMING EVENTS


> Advanced Semiconductor Technology Conference 2015
(July 27 - July 28, Singapore)

> SMTA International
(September 27 - October 1, Donald Stephens Convention Center, Rosemont, IL)

> IWLPC
(October 13 - October 15, San José, CA, USA)
28