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Dow Corning introduces next-generation thermal interface material for higher performing, more reliable integrated chips

Dow Corning, a global leader in silicones, silicon-based technology and innovation, today unveiled new Dow Corning® TC-3040 Thermally Conductive Gel, a next-generation thermal interface material (TIM 1).


ASE and TDK announce plans for a joint venture agreement to manufacture embedded substrates

Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices


Hynix 3D Memory solutions for high performance applications: A closer look

From Dr. Phil Garrou for Yole Développement - At the recent Confab Conference in Las Vegas , Kevin Tran, Sr. Marketing Mgr. of Hynix, announced that they had qualified high bandwidth memory (HBM) for “mass production” in March and that “HBM2 design wins were in progress in multiple market segments”. iMicronews thought this was worth… A closer look.


KYOCERA named supplier of the year by JDSU

Top Honor at JDSU Supplier Day given for outstanding global support.


Amkor: 10 years in Fan-in WLP production and still growing

Yole Développement is pleased to have interviewed Dr. Choon Heung Lee, Executive Vice President for Worldwide Manufacturing at Amkor and President of Amkor Technology Korea about fan-in wafer level packaging (WLP). Amkor is one of the leading fan-in WLP manufacturers today. The fan-in WLP market is forecasted to grow to $8B by 2020, while current demand is outweighing capacity. Learn more by reading the following interview, and then discover Yole Développement’s new report, Fan-in Wafer Level Packaging: Market and Technology Trends.


Fan-Out Wafer Level Packaging platform discussed with SPTS Technologies

Fan-Out Wafer Level Packaging is now entering a new era: with a high expected growth of the market, multiple new companies, OSATs and even foundries, are attracted and involved in this platform. According to Yole Développement’s "Fan-Out and Embedded Die: Technologies & Market Trends report”, the market reached more than $150M in 2014 and a CAGR of 30% for the next 5 years is expected, driven by mobile applications and the need of very thin packages for high I/O devices.



> SEMI Packaging Tech Seminar
(June 18 - June 18, Vila do Conde, Portugal)