Advanced Packaging

EV Group sees doubling of orders for these systems over past 12 months driven largely by production ramp-up of CMOS image sensors and 3D-ICs.

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300-mm polymer adhesive wafer bonding systems.

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Deal Augments Tessera's 3D-IC Capabilities in Rapidly Growing Market Ziptronix Technologies Currently Deployed in $8 Billion Image Sensor Market.

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Toshiba’s recent announcement of TSV based NAND stacking should be considered in light of other announcements on monolithic vertical NAND stacking  by Samsung, Toshiba/Sandisk, Intel/Micron and Hynix. I-Micro thought this was worth ….a closer look.

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IMAPS France will hold the 3rd edition of the Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Application on November 25-26 at the Lyon Metropole Hotel in Lyon, France.  

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Reduced footprint of Dual Cool™ 88 MOSFET boosts power density and improves system efficiency with a low parasitic package

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Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it garnered a 2015 3D InCites Award for new Dow Corning®TC-3040 Thermally Conductive Gel, a silicone-basedthermal interface material (TIM 1) designed to manage heat and support reliable performance for advanced semiconductor flip chip applications. Selected by a panel of 12 judges from industry, academia and the technical

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Upcoming Events


> SMTA International
(September 27 - October 1, Donald Stephens Convention Center, Rosemont, IL)

> IWLPC
(October 13 - October 15, San José, CA, USA)

> THE GREAT MINIATURIZATION: SYSTEMS AND PACKAGING
(November 10 - November 11, Biltmore Hotel, Santa Clara, CA USA)