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Jan 10th, 2014
 
Integrated cooling solutions hot up
 
High power applications and those needing size and weight reductions are driving innovation in power module cooling systems, Aavid Thermalloy, Arkansas Power Electronics International, Danfoss, and Semikron tell Power Dev’.
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It’s a grim consequence of thermodynamics that power electronic engineers must continually fight the unwinnable battle against energy loss as heat. But even if complete victory is impossible, ever better weapons, in the shape of designs with improved efficiency and enhanced cooling technology, are bringing the fight to new fronts. That’s especially important as applications seek miniaturisation and weight reduction, explains Alex Lostetter, Chief executive officer at Arkansas Power Electronics International (APEI), which specialises in high density, high power electronics.

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