Off-roadmap applications like MEMS, image sensors, power components, and LEDs are outpacing the growth of traditional ICs. As a result, this may usher in a bold new era of innovation in creating packaging solutions to meet the needs of off-roadmap apps. This, in turn, will likely prove to be beneficial for more ‘traditional’ ICs too.

Opportunities are clearly emerging in offroadmap applications, if you take a look at forecasts in this area. Yole estimates for 2015 put the MEMS market in excess of $17B; the CMOS image sensor/camera module market at $13B; the power module market at $4.4B; and the packaged LED market at $21.6B.

Affinity for 3D packaging
Some off-roadmap applications appear to have a natural affinity for 3D packaging technologies. A close look at MEMS, in particular, reveals an undeniable tie to 3D packaging. As Tomas Bauer, vice president of sales and business development at Silex Microsystems, sums it up: 3D packaging technologies are “genetically close” to MEMS technologies.

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