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Dec 11th, 2013
System integration ups the ante: Amkor leadership positions for a changing packaging industry
The proliferating options for system integration are driving change across the packaging industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solutions. Amkor counts on its solid base of platform technologies to ease transition to this next generation.
System integration is the key issue driving the packaging sector, with integration at the board, wafer, and die level happening simultaneously, notes Ron Huemoeller, Amkor SVP of Advanced Product Development. Although disruptive changes are afoot in all these areas, the basic platforms and accumulated learnings for handling common issues like thinning, warpage and chip/package interactions are largely already in place. “All the resources and money we’ve put into packaging technology for the smart phone has quietly built up a strong infrastructure for the future,” adds ChoonHeung Lee, Corporate VP of Product Management.
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