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ams Ambient Light Sensor with WLCSP TSV Packaging
Jan.2016

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3 290 €

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Description

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World’s Smallest Ambient Light Sensor for Wearable Applications

ams has adopted through-silicon via (TSV) packaging technology for advanced light sensor technology. TSV technology, with the advantage of having in-house wafer fabrication expertise, eliminates the use of wire bonds and provides a direct connection from the device I/Os to a solder ball.

Featured in the latest Samsung smartwatch, the TSL2584TSV ALS is only 1.14 x 1.66mm footprint and 0.32mm height. The small thickness of the TSV package technology addresses the small form factor requirement in wearable products (watch, glasses…). ams uses for this device an untraditional and elegant tungsten TSV-last process compared to copper filled TSV used by many other players.

The component uses a wafer level chip scale package (WLCSP), but compared to traditional WLCSP ALS which use a Shellcase process, it features a TSV packaging process. With this technology, the thickness of the component can be thinner and thus can be better integrated in wearable products.

The on-chip photopic infrared-blocking interference filter that rejects unwanted UV and IR is thinner compared to others ambient light sensors due to the suppression of the Shellcase glass substrate.

The report also includes a comparison with ams Ambient Light Sensors featured in the iPhone 6s and Samsung Galaxy S6.

 

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Table of contents

Overview / Introduction


 

Company profile & Supply Chain


 

Physical Analysis


> Physical Analysis Methodology


> Sensor Die
  - Sensor View & Dimensions
  - Sensor Marking
  - Sensor Packaging
  - Sensor Delayering
            - CMOS Process
            Photodiodes
            - TSV
  - Sensor Cross-Section
             - Substrate
             - Metal Layers
             - Filter
            IC Process
            Photodiodes
            TSV
             - RDL & Solder Bump

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


Global Overview
Sensor Front-End Process
Sensor TSV Packaging Process Flow
Wafer Fabrication Unit

 

Cost Analysis


> Sensor Front-End Cost
Sensor TSV Packaging Cost
TSV Packaging Cost per Steps
Sensor Filter Cost
Sensor Wafer Cost
Sensor Die Cost
Sensor Test Cost
Sensor Cost & Price

                                              

Selling Price


> Sensor Price Estimation

 

Comparison with ams ALS in iPhone 6s & Samsung Galaxy S6


 

  

 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison with ALS featured in iPhone 6s & Samsung Galaxy S6