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CREE 1700V SiC Module - First 1700V SiC MOSFET with Z-Rec SiC Diode
Mar.2015

cree cas300m17bm2 icone
3 490 €

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Description

Icone CREE CAS300M17BM2 Flyer.pdf Adobe Acrobat StandardA specific SiC epitaxy with a dual layers structure for a very low Rdson of 8mΩ.

The CAS300M17BM2 from CREE Semiconductor is a 2-transistor  power module with a breakdown voltage of 1700V for a current of 225A (90°C), an ultra low on-resistance (8mΩ), a fast switching speed and a fast reverse recovery.

The 1700V module  integrates twelve 2nd generation high-voltage SiC power MOSFET dies with a current of 50A (90°C) for 29sq mm.

Twelve Z-Rec diodes of 36 sq mm are integrated in the power module. The Z-Rec diode is a mix between a Schottky and junction barrier diode.

The  1700V MOSFET has a new gate design, a more sophisticated ohmic contact and an optimized technology to reduce the epitaxy layer thickness. A comparison with a 1200V SiC module is done in the report for the MOSFET, Diode and Module.

Based on a complete teardown analysis, the report provides an estimation of the production cost of the CAS300M17BM2 package, SiC MOSFET Transistor and Schottky Barrier Diode.


COMPLETE TEARDOWN WITH:

  • Detailed photos and identification
  • Comparison between the 1700V and 1200V power module, MOSFET, Diode
  • Manufacturing process flow  of MOSFET and Diode
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

CREE CAS300M17BM2 image




Table of contents

1. Overview / Introduction

2. Companies Profile    

  -  CREE Profile

3. CAS120M12BM2 Characteristics

  -  CAS300M17BM2 Characteristics

4. CAS120M12BM2 Physical Analysis

  -  Physical Analysis Methodology
  -  Package Views & Dimensions

MOSFET
  -  Die View, Dimensions & Marking
  -  Guard Ring
  -  Cross-Section Gate
  -  Substrate and Epitaxy Layers, Backside
  -  MOSFET Characteristics

Diode
  -  Die View, Dimensions & Marking
  -  Guard Ring, Cross-Section
  -  Substrate and Epitaxy Layers
  -  Backside
  -  Diode Characteristics

Comparison 1700V and 1200V
  -  Module, MOSFET, Diode
5. Manufacturing Process Flow
  -  Global Overview
  -  MOSFET Front end Unit, Tests Unit
  -  Transistor Process Flow
  -  Diode Front end Unit, Process Flow
  -  Diode Process Flow
  -  Power Module Process Flow

6. Cost Analysis

  -  Synthesis of the cost analysis
  -  Main steps of economic analysis

MOSFET
  -  Yields Hypotheses
  -  MOSFET Epitaxy Cost
  -  MOSFET Front-End Cost
  -  MOSFET Wafer Cost
  -  MOSFET Cost per process steps
  -  MOSFET : Back-End : Probe and

Diode

CAS300M17BM2
  -  Package & Final Test

7. Price Estimation


Contact


 

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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