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Efficient Power Conversion EPC2040 15V eGaN FET for LiDAR Systems
Apr.2016

rs257_epc2040_gan_on_si_hemt_system_plus_consutling_1
3 290 €

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Description

EPC2040 flyer

Extremely fast switching GaN-on-silicon HEMT for guidance in 3D sensing for augmented reality systems and autonomous vehicles

The EPC2040 is a 15V eGaN FET© from Efficient Power Conversion for high frequency pulsed applications like LiDAR (Light Distancing and Ranging). The ability of EPC2040 to switch ten times faster than MOSFETs increases the resolution, response time and accuracy of capturing three dimensional LIDAR images.

The EPC2040 is a GaN-on-silicon HEMT (High Electron Mobility Transistor) designed by EPC, manufactured by Episil and supplied in passivated bare die form with solder balls. The wafer level package is well suited for high frequency functions with low inductive parasitic levels. WLCSP (Wafer Level Chip Scale Packaging) produces a small die, at just 0.85 mm x 1.20 mm, at low packaging cost.

 

RS257 EPC2040 GaN on Si HEMT System Plus Consutling 2

 

The report presents deep technology analysis of the packaging and components with images of the complex GaN epitaxy layer stack and transistor structure.

It also includes production cost analysis and overall comparison with the first EPC GaN HEMT.

 

Melexis 2016 3

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


 

Company profile


> EPC Profile

> Episil Profile

 

 

EPC2040 Characteristics


 

Physical Analysis


> Package
    - Package Views & Dimensions
    - Package Cross-Section
    - Pad Cross-Section
> GaN transistor
    - Die View, Dimensions & Marking
    - Edge of the Die
    - Metal Layers
    - Gate Cross-Section
    - Source Cross-Section
    - Drain Cross-Section
    - Substrate and Epitaxy Layers
> GaN Transistor Characteristics

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> Global Overview
> GaN Transistor Front end Unit
> Transistor Process Flow
> Packaging Process Flow

 

 

Cost Analysis


> Synthesis of the cost analysis
> Main steps of economic analysis
> Yields Hypotheses
> Epitaxy Cost
> Front-End Cost
> Wafer Cost
> Wafer Cost per process steps
> Probe and Dicing Cost
> Packaging Cost
> Final Test Cost
> EPC2040 Component Cost

 

 

Price Estimation


                                              

Comparison of 3 EPC transistors


 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price

  • Comparison with EPC’s EPC1010 and EPC 2010 transistors