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InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub
Apr.2016

icm30630_invensense_package_opening_gyro_acc_6-axis_system_plus_consulting
3 490 €

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Description

ICM30630 InvenSense flyer

World’s first tri-core 6-axis motion tracking solution with integrated sensor-hub framework software

With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution.

The ICM-30630 is the latest version of InvenSense’s 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power. 

In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics.

ICM30630 InvenSense Package opening Gyro Acc 6 axis System Plus Consulting

ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU.
Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform.

 

ICM30630 InvenSense Package spring SEM view Gyro Acc 6 axis System Plus Consulting


This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense’s incredibly smart design.

ICM30630 InvenSense Package optial view Gyro Acc 6 axis System Plus Consulting

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview / Introduction


Invensense Company profile


Physical Analysis


> Physical analysis
- Physical analysis methodology
> Package
- Package characteristics: view, dimensions, and opening
- Package cross-section
> MEMS Dies
- View, dimensions, and markings
- Bond pad opening and bond pad
- MEMS cap removed and details
- Sensing area details
- MEMS cross-section
- MEMS process characteristics
> MCU Die
- View, dimensions, and markings
- Delayering and main blocks ID
- Process and die cross-section
- Die process characteristics

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


- Global overview
- ASIC & MCU front-end process
- MEMS process flow
- ASIC and MCU wafer fabrication unit
- Packaging process flow and assembly unit

 

 

Cost Analysis


- Main steps of economic analysis
- Yields hypotheses
- ASIC & MCU front-end cost
- MEMS front-end cost
- MEMS MEMS assembly cost
- ASIC & MCU back-end 0: probe test and dicing
- ASIC & MCU wafer & die cost
- MEMS front-end cost
- MEMS front-end cost per process steps
- MEMS back-end 0: probe test and dicing
- MEMS wafer and die cost
- Wafer & die cost
- MCU die cost
- Back-end: packaging cost
- Back-end: packaging cost per process steps
- Back-end: final test cost
- Component cost and price

                                              

Comparison with Bosch BMF-055 9-Axis Sensor Hub and previous-generation 6-Axis IMU


 


About the authors



ABOUT SYSTEM PLUS CONSULTING

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed Photos

  • Precise Measurements

  • Material Analysis

  • Manufacturing Process Flow

  • Supply Chain Evaluation

  • Manufacturing Cost Analysis

  • Estimated Sales Price

  • Comparison with Bosch BMF-055 9-Axis Sensor Hub and previous-generation 6-Axis IMU