Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7
The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.
The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.
SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.
Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.
The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.
The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.
This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons.
Overview / Introduction
Company profile & Supply Chain
> Physical Analysis Methodology> Samsung Galaxy S7 Disassembly - Component Removal> Packaging Analysis - Package View and Dimensions - Package Opening - Package Cross-Section> LED Dies Analysis - Dies View and Dimensions - Dies Cross Section - Dies Process> Main Die Analysis - Die View & Dimensions - Die Cross Section - Die Process
Manufacturing Process Flow
> LED Fabrication Unit> LED Process Flow> Chip Fabrication Unit> Chip Process> Package Fabrication Unit> Package Process Flow
> Synthesis of the Cost Analysis> LED Cost Analysis - Epitaxy Step - LED Epitaxy Cost - LED Front-End Cost - LED Wafer Cost - LED Cost per Process Step> Die Cost Analysis - Wafer Front-End Cost - Die Cost> Package Cost Analysis - Packaging Cost - Component Cost
Estimated Price Analysis
> Manufacturer Financial Ratio> Estimated Selling Price
Technology and Cost Comparison with Previous Generation of Heart-Rate Sensor
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Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems. www.systemplus.fr.
LED & Module Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Estimated Sales Price
Comparison with previous generation