An absolute pressure sensor used in car and truck tire pressure monitoring systems for harsh environments
The Melexis MLX91802 is an absolute pressure sensor used in industrial and automotive applications for harsh environments (-40°C to 150°C), particularly in tire pressure monitoring systems (TPMS) for cars and trucks, with a pressure range of up to 1,400 KPa. The Melexis ASIC die integrates an LF transmitter at 125 KHz to facilitate the integration of the MLX91802 in a TPMS.
It is easy to use with either the factory calibration, Melexis’ firmware, or custom firmware, and is compatible with other integrated functions like the temperature sensor and battery monitoring.
This Melexis-designed MEMS pressure sensor is based on very reliable technology, with a thick membrane and a sealed cavity. Melexis’ smart packaging approach makes it easy to integrate into a system, and it is inexpensive. The absolute pressure measurement uses a soft coating rather than complex packaging with manifolds.
This report presents a detailed analysis of sensor structure and cost, as well as a characteristics comparison between Infineon’s SP37, Freescale’s FXTH87, and Melexis’ MLX91802, highlighting the different technical choices made by each company.
Overview / Introduction
Company profile & Supply Chain
> Melexis> X-Fab> MLX91802 Characteristics
> Physical Analysis Methodology
> Package- Package views, dimensions, and pin out- Package opening & wire bonding process- Package cross-section> ASIC - View, dimensions & marking- Delayering- Main blocks’ identification- Process identification- Cross-section - Process characteristics> MEMS Pressure Sensor- View, dimensions, and marking- Sensing area details- Cross-section- Piezoresistors- Process characteristics
Comparison with Infineon’s SP37 and Freescale’s FXTH87Analysis
Manufacturing Process Flow
> Global Overview> ASIC Front-end Process> ASIC Wafer Fabrication Unit> MEMS Pressure Sensor Process Flow> MEMS Wafer Fabrication Unit> Packaging Process Flow & Assembly Unit
> Synthesis of the Cost Analysis> Main Steps of the Economic Analysis> Yields Explanation & Hypotheses> ASIC Die- ASIC front-end cost- ASIC probe test & dicing cost- ASIC wafer & die cost> MEMS Pressure Sensor Die - MEMS pressure sensor front-end cost- MEMS pressure sensor cost per process steps- MEMS pressure sensor probe test & dicing cost- MEMS pressure sensor wafer & die cost> Back-end: Final Test & Calibration Cost> MLX91802 Component Cost
Estimated Sales Prices
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Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price
Comparison with Infineon’s SP37 and Freescale’s FXTH87