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3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update
Sep.2016

2016_business_updated-1
6 490 €

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Description

couv 2016 Business Update

3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.

TSVS have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?

Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.

CIS still commanded more than 70% share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.

2016 Business Updated 1 

TSV technology: a key platform for heterogeneous integration

The market for TSV technology will continue to grow, with a CAGR exceeding 10% over the next five years, helped by the next wave of adoptions. These include AMD’s introduction of high-bandwidth memory (HBM) in its high-end graphics cards, and Intel’s launch of its Knights landing processor, which features a variant of Micron’s hybrid memory cube (HMC). Meanwhile, Apple’s latest smartphones implement TSV technology in FPS.

2016 Business Updated 2

Both AMD and Nvidia have announced new graphics products exploiting next generation HBM2 technology. Other announcements include networking OEMs such as Cisco and Juniper Networks with switches and routers integrated with HMC and HBM technology. And memory suppliers SK Hynix, Samsung and Micron have already announced the specification for third generation HBM3 and HMC3.

Another important market is 3D stacked (3DS) memory, also known as 3D DDR4, for servers. Yole believes that the market share of 3DS could surpass other 3D memories in next 10 years. Samsung and SK Hynix are already in high-volume manufacturing with 3DS products and Micron too will soon enter this market.

With the adoption of HBM in GPU graphics products, silicon interposers are becoming an asset for the integration of components with small feature sizes. Silicon interposers are the key substrates for heterogeneous integration of at least one logic IC with memory die and even possibly mixed signal or analog ICs. The main applications are GPUs, integrating logic and memory, FPGAs for die partitioning, and large ASICs for high end applications. The main remaining issue with silicon interposers is the cost. Currently the cost of silicon interposers with TSVs is still in the $1000 range, but it is trending downwards towards becoming accessible for manufacturing. Samsung has newly entered the silicon interposer market, joining the few other suppliers of high density interposers below 1µm L/S, TSMC, Global Foundries and UMC. UMC is the key supplier for AMD’s graphics products. Other players are looking for alternative TSV-less technology that provides similar interconnect density to silicon interposers, such as Amkor’s SLIM, SPIL’s SLIT, Intel’s EMIB, and Shinko’s iTHOP.

Avago is the key supplier for RF BAW filters that use TSV technology. The number of filters per smartphone will increase to around 35 by 2020. Along with the migration to 4G/5G networks, this will keep demand for BAW filters high.

TSVs have also penetrated new sensor applications, driven mainly by FPS and Ambient Light Sensors (ALS) for mobiles and wearables. As well as the FPS using TSV technology in the latest iPhone, ams launched the smallest ALS yet manufactured using TSV technology. Applications like photonics will most probably see this technology in products coming onto the market in the next four years. The report will describe all the different products, their specifications, requirements and main challenges.

2016 Business Updated 3 

Will 3D TSV open the doors for new packaging strategies

All the top Outsourced Semiconductor Assembly and Test (OSAT) companies have the 3D/2.5D Mid-End-of-Line (MEOL) assembly capability but the actual utilization rate is very low. Amkor in particular has invested heavily in 3D/2.5D MEOL but their investment has not paid off yet. The key reason is that it has focused mainly on the 2.5D assembly and the market is still limited, although Yole is starting to see some production.

For 3D stacking, memory companies have in-house assembly capabilities, although Amkor is trying to get memory stack business from SK Hynix. OSATs are moving into MEMS and sensor assembly, which has higher volume, for example with ASE doing via-last TSV assembly of various MEMS sensors.

With foundries also offering turnkey solutions where they partner with OSATs to provide complete 3D/2.5D assembly, this technology is opening the door to a different manufacturing ecosystem. The report will discuss the various business models and strategies of OSATs and foundries to increase their market share for TSV applications. It will also provide detailed analysis of the supply chain for key products and players.

2016 Business Updated 4 

what's new

  • Updated wafer forecast for 3D memory, CMOS image sensors (CIS), MEMS and other sensors
  • Updated revenue and unit forecast for 3D memory, CIS, MEMS and sensors and all applications using TSVs
  • Updated market adoption roadmap for 3D/2.5D products
  • Forecast for new 3D TSV applications such as fingerprint sensors (FPS), ambient light sensors (ALS), LEDs, silicon photonics, radio frequency, etc.
  • Supply chain for various 3D/2.5D devices
  • Section added for OSAT companies and foundries involved in 3D/2.5D TSV packaging
  • TSV products benchmarking
  • Teardowns of key products
  • Alternative TSV-less packaging technology

Objectives of the Report

This report’s objectives are to:

  • 3D/2.5D IC packaging technology and market trends by application
  • Wafer forecast for 2015-2021 for different TSV applications in $, units and number of wafers
  • Market status of current and future 3D IC products
  • Technology roadmap by device
  • New TSV technology application areas
  • Overview of key players and supply chain activities
  • OSAT and foundry strategies

 

Table of contents

Introduction, definitions & methodology  3


II. Executive summary  15


III. Packaging and interconnection trends   36


IV. 3D/2.5D IC TSV  technology  53


•    Market drivers
•    Applications
•    Wafer  starts  broken down  by application
•    Wafer capacity forecast 2015-2021
•    TSV products  timeline

 

V. Memory 74


•    Introduction and definition
•    Market drivers
•    Players involved in 3D memory
•    Memory products based on TSV
       - Comparative analysis
•    3D stacked memory adoption timeline
•    Market forecast (2015-2021)
      - By wafer capacity
      - By revenue
•    3D memory application segmentation
•    3D memory application roadmap
•    Key challenges
•    Outlook and summary

 

VI. MEMS and sensors   106


•    MEMS and sensors with TSVs
•    Key players
•    Market and technology drivers
•    Different TSV architectures in MEMS
     - Accelerometers
     - FBAR filters
•    Recent applications
•    Market forecast 2015-2021
     - By units
     - By wafer starts
     - By revenue
•    Outlook and summary

 

VII. CMOS Image sensors (CIS)   119


•    Market and technology trends
     - 3D stacked BSI technology
•    Key players
•    Market forecast 2015-2021
     - By units
     - By wafer starts
     - By revenue
•    Outlook and summary

 

VIII. 2.5D interposer   139


•    Market and technology trends
•    Products using TSV interposers
•    Key  players: interposer suppliers
•    Player capacities
•    2.5D interposer roadmap
•    Recent developments
•    Challenges  from alternative  technologies, including TSV-less interposers
•    Outlook and summary

 

IX. Other TSV applications    151


•    LEDs
     - Market and technology trends
     - Key players
     - Recent developments
     - Market potential
•    Silicon photonics
     - Market and technology trends
     - Key players
     - Recent developments
     - Market potential

 

X. Supply chain   158


•    Various 3D TSV business models
•    Graphics products announced in 2016
•    Networking OEM products in development
•    Supply chain of key products
•    Key networking product OEMs
•    Current and future products development (3D /2.5D TSV)
•    Outlook and summary

 

XI. TSV product benchmarking  173


•    AMD Radeon R390 with SK Hynix HBM stack
•    Samsung DDR4 3D RDIMMs

 

XII. OSATs involved in 3D/2.5D IC  packaging   179


•    Key players
•    Technological  capability
•    Recent activities
•    Key customers
•    Opportunities and challenges  
•    Outlook and summary

 

XIII. Foundries involved in 3D/2.5D IC  packaging   189


•    Key players
•    Technological  capability
•    Recent activities
•    Key customers
•    Opportunities and challenges  
•    Outlook and summary

 

XIV. Conclusion  200


XV. Appendix   205


XIV. Yole presentation   215


Companies cited

Allvia
Altera
AMD
Amkor
ams
Apple
ASE
ASET
Avago Technologies
Besi
Broadcom
China WLCSP
Chipmos
CISCO
Dongbu Hitek
EPWorks
eSilicon
Fraunhofer-IZM
Freescale
Fujitsu
GalaxyCore
GlobalFoundries
G-MEMS
Hanamicron
Huawei
SK-Hynix
Ibiden
Inotera
IBM
IMEC
IME
Infineon
Intel
IPDIA
ITRI
JCAP
Juniper
KAIST
LG
Leti
LSI Corporation

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Marvell
Mediatek
Medtronic
Micron
Murata
NCAP
NEPES
NVidia
NXP
Omnivision
Oracle
PTI
Q-Tech
Qualcomm
Samsung
Silex Microsystems
Sematech
Shinko Electric
Sony
SPIL
StatsChipPAC
Renesas
STMicroelectronics
SMIC
Teledyne Dalsa
TSMC
Tecnisco
TEL
Tessera
Texas Instruments
Tezzaron
Toray
Toshiba
TowerJazz
UMC
UTAC
X-Fab
Xintec
Xilinx
Ziptronix
and more...

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

KEY FEATURES OF THE REPORT

  • Latest 3D/2.5D technology industry trends
  • Wafer start forecast for different TSV applications including memory, MEMS, CMOS Image Sensors (CIS) and HB LEDs
  • Revenue and unit forecast by TSV application
  • Detailed analysis of all TSV applications
  • Commercialization status by product family
  • Overview of TSVs from different business models
  • Key industrial market player positioning: device makers, R&D centers, OSAT companies, foundries