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SEMIKRON SKiM306GD12E4 1200V 300A IGBT Solderless Module
Sep.2015

yole_semikron_icone
3 490 €

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Description

Yole Semikron flyerSKIM 63, solderless, sinter technology power module developed for high reliability operation in a light module

The SKiM306GD12E4 is a 1200V 300A 6-pack configuration with 3 separated half bridges for high reliability operation.
Semikron uses silver sinter technology to increase the durability and pressure contact to obtain a solderless power module.

The SKiM306GD12E4 is based on IGBT4 technology from Infineon and CAL4-F diode. Semikron has designed the CAL4-F diode to be very efficient with the IGBT4. The diode has been designed to obtain a good resistance to environment in a non hermetic package and benefits from the expertise of Semikron in the irradiation to reduce the carrier lifetime.

Yole Semikron iconeThe SKIM 63 module is a no baseplate design. The DBC substrates are directly assembled on the heatsink to enhance the power management and reduce the height of the module.


The sinter layer is very thin to decrease the thermal resistance and limit the cost of silver material. With a cost close to a classic SAC solder, the sintered joint increases the service life.


The report presents a deep technology analysis of the packaging and of the transistors and diodes structures.

It also includes production cost analysis and a specific economic comparison with Infineon FS100R12PT4 1200V 100A.

Yole Semikron img

COMPLETE TEARDOWN WITH:

  • Detailed photos and identification
  • Analysis of silver sinter, pressure contacts
  • Analysis of transistor and diode structure
  • Manufacturing process flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation
  • Comparison of SKiM306GD12E4 vs. Infineon FS100R12PT4

Table of contents

1. Overview / Introduction                             4


2. Companies Profile                                       8


3. Physical Analysis                                       13


Synthesis of the Physical Analysis

Package analysis

  • View and dimensions and marking
  • Housing
  • Base Plate Cross-Section
  • DBC Cross-Section
  • SKIM 63 Module

IGBT Analysis

  • Dimension
  • Gate Supply Line and Guard Ring
  • Trench Gate Cross-Section
  • Revelation
  • Infineon IGBT4 vs IGBT3

Diode Analysis

  • Dimension
  • Guard Ring
  • Revelation

 

4. Manufacturing Process Flow                      61


  • Overview
  • IGBT and Diode Process Flow
  • Description of the Wafer Fabrication Units
  • IGBT Process Flow
  • Diode Process Flow
  • Package Process Flow

5. Cost Analysis                                             76


Synthesis of the Cost Analysis

  • Main Steps of Economic Analysis
  • Yields Explanation
  • Cost Analysis IGBT
  • Wafer Cost Hypothesis
  • IGBT Wafer Cost
  • Breakdown per process step
  • IGBT Probe Cost
  • IGBT Die cost

Cost Analysis Diode

  • Wafer Cost Hypothesis
  • Diode Wafer Cost
  • Breakdown per process step
  • Diode Probe Cost
  • Diode Die cost

Cost Analysis SKiM306GD12E4

  • Assessing BOM
  • DBC Cost
  • SKiM306GD12E4 Module Cost
  • Yield Synthesis

 

6. Estimated Manufacturer Price Analysis      107


  • Manufacturers ratios
  • Estimated manufacturer Price

7. Comparison                                              110


  • Comparison SKiM306GD12E4 and Infineon FS100R12PT4

 

SYSTEM PLUS CONSULTING

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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