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Wolfspeed RF GaN HEMT CGHV40100F
Oct.2016

wolfspeed_cghv40100f_gan_hemt_rf_transistor_system_plus_consulting
3 290 €

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Description

Wolfspeed GaN HEMT RF flyer

The 50V RF GaN HEMT from Wolfspeed is designed and manufactured with specific technical choices, making it a unique product

Wolfspeed (Infineon) offers a broad range of GaN RF products that are in high demand throughout the energy, ele-ctronics, industrial, transportation, and military telecommunications sectors. The company’s new CGHV40100 is a unique gallium-nitride (GaN) high-electron-mobility transistor operating from a 50-volt rail and up to 3-GHz.


The CGHV40100 includes a single GaN-on-SiC HEMT die with an area of 4.17mm2. To make the source connection, the device is manufactured on ultra-thin wafer with gold vias. The HEMT shows the typical GaN epitaxy structure for lateral device and a source-connected field plate.

 

Wolfspeed CGHV40100F GaN HEMT RF Component System Plus Consulting

The device is assembled in a SOT467C package with ceramic substrate materials that possess0an excellent combination of electrical, mechanical, and thermal properties. The flange material is CuMoCu heatsink, which has good mechanical properties but is quite expensive. Very specific and optimized choices went into the device’s design and manufacturing, resulting in a competitive, stunning product.


This report also includes complete chip and module fabrication process overviews, and an estimated cost.

Wolfspeed CGHV40100F GaN HEMT RF Package System Plus Consulting

 

 

  

 

 

   

Table of contents

Overview / Introduction


> Executive Summary

> Reverse Costing Methodology

 

 

Company profile 


 

Physical Analysis


> Synthesis of the Physical Analysis
> Package
- Package view and dimensions
- Package opening
- Package cross-section
> HEMT Die
- Die view & dimensions
- Die marking
- Die process
- Die cross-section
- Process characteristics

 

 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Manufacturing Process Flow


> Overview

> Wafer Fabrication Unit
> Packaging Fabrication Unit

 

 

Cost Analysis


> Synthesis of the Cost Analysis
> Main Steps of Economic Analysis
> Yields Synthesis
> Die Cost Analysis
- Front-end cost
- Back-end 0: probe test & dicing cost
- Wafer cost
- Die cost
> Packaging Cost Analysis
- Packaging cost
- Packaging step cost
> Components Cost

                                              

 

Selling Price Estimation


> Financial Results and Correction Factors
> Manufacturer Price

 

 


About the authors



ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems. Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product. System Plus Consulting engineers are experts in Integrated Circuits - Power Devices & Modules - MEMS & Sensors - Photonics – LED - Imaging – Display - Packaging - Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Package & die analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price