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 Embedded Die Packaging Reports Bundle

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How is embedded die being pushed by substrate makers and OSATs to become a new advanced packaging platform?

Embedded die is now in volume production for small applications such as DC/DC converter but just emerging as a real alternative to the existing large volume packaging platforms. As more PCB makers are looking at alternative markets and technologies to boost their sales, we can expect more to come in the next months, in order to place embedded die as a real packaging option.

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