Cree and Philips both hold broad and substantial optoelectronic patent portfolios that are important to their respective businesses. The new agreement covers patents from both parties in the fields of blue LED chip technology, white LEDs and phosphors (including remote phosphors), control systems, ...

---

---

The term thick-SOI refers to a semiconductor substrate with an active, single-crystal silicon layer whose thickness exceeds 1µm. It lies on a buried oxide which is set on top of a silicon wafer carrier. This structure is widely used in MEMS and in Power Device electronics. In 2007, thick-SOI substrates accounted for a $72M market, representing approximately 380,000 6” (equiv.) wafer units.MEMS ...

---

InPACT is the primary producer of Indium Phosphide (InP) 2”, 3” and 4” substrates outside of Japan. The company sells the 2” diameter mainly for opto telecom and datacom chips; the 3” and 4” products are used for high speed ICs and PICs. InPACT keeps its technical edge on surface contamination and local flatness performance and grows the longest InP boules (see below a 4” boule standard ...

---

Please download Jeff Perkins’ presentation made during Semicon West 2010 ...

---

A comprehensive survey of usage and markets through 2013 for: GaAs, GaP, InP, SiC, Sapphire and bulk-GaN...