In terms of package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.
There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.
MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.
OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying several key trend in this space.
Join the live webcast to get a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.
Jerome Baron is the business unit manager of the advanced packaging market research at Yole Developpement. He has been following the 3D packaging market evolution since its early beginnings at the device, equipment and material levels. He was granted a Master of Science degree from INSA-Lyon in France as well as a Master of Research from Lyon Institute of Nanotechnology.
Jeff Perkins has been working with emerging technologies for over 20 years and is responsible for Yole’s activities and Business Development in North America. Jeff has a BS in Engineering from the University of Colorado, Boulder and an MBA from INSEAD, Fontainebleau, France.
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