- Karen Lightman, Executive Director, MEMS Industry Group will introduce the MEMS Industry Group
- "New Technologies for the Next-Generation Inertial MEMS", Laurent Robin, Activity Leader Inertial MEMS Devices & Technologies, Yole Développement.
MEMS inertial sensors will achieve 11% growth in 2013, becoming a $4.0B market. This industry will enjoy continuous expansion in the future, as motion sensor shipments are currently booming. Although we see ongoing adoption in Automotive and an increasing interest in high-performance applications, the strongest wafer shipments’ driver is consumer applications.
To match these market drivers, component and die size are still being optimized, while combo approaches such as 6 and 9-axis sensors are becoming mainstream. Diverse technical solutions are being developed to optimize the front-end processing steps and the packaging of consumer inertial sensors. We also observe that disruptive approaches are being considered for the next generation of sensors, with new detection principles and new designs such as piezo detection, MEMS-compatible magnetometers, integration of nano structures, and more.
This webcast will provide a market situation update and identify the major market drivers. Front-end and packaging evolutions will be discussed and a specific focus will be applied to the most promising new approaches. Lastly, we’ll discuss the details of sensors recently released on the market and which are already implementing new technologies.
- "Advanced Packaging and Integration Techniques for Inertial MEMS", Robert Hergert, PhD, Senior Process Development Engineer, SUSS MicroTec Inc.
As MEMS inertial sensors become more prevalent in consumer applications there is a growing need to reduce package size and increase performance, while reducing overall production costs. In the back-end this can be achieved through innovative wafer level packaging and integration techniques. The key technologies to achieve these goals are found in wafer bonding and 2.5D/3D integration.
Inertial sensors perform better when encapsulated in a controlled environment. This environment can be achieved through wafer level packaging. Several wafer bonding technologies can be used to achieve the hermitic environment required for high-performance inertial sensors. We will explore the design constrains, advantages and disadvantages of several of these wafer bonding techniques.
2.5D and 3D integration can further reduce the size and improve performance by allowing the stacking of sensors and CMOS circuitry. TSVs and interposers allow for a higher level of integration while reducing the overall size of the package. We will explain the advantages and challenges of implementing these techniques.
We provide an update on the state of the art wafer level packaging and integration techniques. As these methods gain broader application in the market inertial MEMS sensors will see a marked decrease in size and cost with an increase in performance.
Dr. Robert Hergert started his career as a computer programmer and computer forensics analyst with the U.S. Air Force. He received his B.S. in Electrical Engineering at the University of Maryland on a military scholarship. He then spent 3 years as a program manager and systems engineer for satellite systems in Los Angeles. After leaving the military, he worked in software systems consulting for before moving to London to pursue his PhD in Electrical Engineering, at Imperial College London, with a focus on MEMS design and fabrication. He currently works for SUSS MicroTec as a Senior Process Development Engineering in wafer bonding and lithographic technologies. He has extensive experience in evaluating and optimizing wafer-level packaging technologies.
Karen Lightman is executive director of MEMS Industry Group since 2013. She played a pivotal role in launching MEMS Industry Group (MIG) in January 2001. In June 2007 she became MIG’s managing director. Ms. Lightman is active on the worldwide MEMS conference circuit as a keynote speaker and panelist promoting the commercialization of MEMS across global markets. She spearheads strategic growth for MIG, implementing a cohesive vision through programs, events and international partner programs which advance the MEMS industry.
Laurent Robin is in charge of the MEMS & Sensors market research at Yole Developpement. He previously worked at image sensor company e2v Technologies (Grenoble, France). He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.
Mike McLaughlin has been working with emerging technologies for over 12 years at IBM and Cisco and was a principal analyst at Gartner. He now leads all of Yole's activities and business development for North America. Mike is a graduate of Stanford University in Palo Alto, CA.