Teledyne DALSA’s webcast describes the new MIDIS™ platform developed specifically to allow users to design their own motion sensors for consumer electronics using a stable well characterized process architecture. The MIDIS platform breaks the one-process-per-product MEMS paradigm, greatly reducing development costs and time to market.
“Our MIDIS™ platform is a break-through technology that greatly reduces time to market by using a standardized process, rather than developing each new device from the ground-up, while making no compromises in performance,” said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor. “Our high performance Through Silicon Via (TSV) and wafer bonding approach provides high vacuum and hermeticity, without the need for expensive getters, in a very compact wafer level package.”
During this live event, attendees will discover key features of this 200 mm MEMS technology. Teledyne DALSA will details how MIDIS™ allows accelerometers, gyroscopes or combo-sensors to be integrated in a very compact hermetic wafer level package which can be wire bonded or solder bumped.
Moreover, attendees will learn how a high vacuum can be maintained in the package cavity allowing resonator Q factors in excess of 20,000, without the need for expensive getters.
Developers attending the webcast will learn how the MIDIS platform has been successfully deployed with alpha customers and how it is now being released to the wider market.
Join our live webcast to learn more about MIDIS™
Luc Ouellet, P.Eng., Vice President of Technology Development at Teledyne DALSA Semiconductor in Bromont, Quebec, Canada.
With almost 30 years of experience and a degree in Engineering Physics (École Polytechnique de Montréal), he has technical expertise in surface treatment technologies and non-invasive and non-destructive thin film characterization technologies and specializes in fabrication technologies for MEMS, photonics, micro-fluidics, epitaxial semi-conductors, thin films, semi-conductors equipment, ultra-high vacuum equipment, and ultra-high purity gas distribution systems. In addition, he has participated in over 30 publications and conference and has secured over 50 patents during the course of his career. He currently serves as an industry expert on the scientific committees of NanoQuébec, the MiQro Innovation Collaborative Centre (C2MI), and the Conseil consultatif de l'École Polytechnique (COCEP).
Laurent Robin, Technology & Market Analyst, Inertial MEMS Devices & Technology, Yole Développement
Laurent Robin is in charge of the MEMS & Sensors market research at Yole Developpement with a focus on inertial sensors & RF MEMS related technologies. He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France
Mike McLaughlin, Business Development, Yole Inc.
Mike McLaughlin has been working with emerging technologies for over 12 years at IBM and Cisco and was a principal analyst at Gartner. He now leads all of Yole Développement's activities and business development for North America. Mike is a graduate of Stanford University in Palo Alto, CA