Growth rate is still high, but the market shows early signs of maturity.
Many “WLP” technologies are now cruising at a very high altitude. This is serious business: over 23 billion units packaged with ‘fan-in’ as we may call it are expected to sell and be mounted in smartphones, tablet PCs or other mobile devices in 2011. For size reduction, together with low cost, remains the main driver for adoption of this technology. If ‘fan-in’ WLCSP already reached high penetration rates in mobile applications for connectivity (Bluetooth+WLAN+FM combos, GPS) and analog integrated circuits (DC/DC converters, LDO’s, ESD/EMI protection devices), it is still growing fast for some other IC types as well as in MEMS and sensors. We are not at a time to claim that “Wafer Level Packaging” is taking off any longer.
Lionel Cadix joined Yole Développement after the completion of several projects linked to the characterization and modeling ofhigh density TSV and 3DIC chip stacking in collaboration with CEALeti and STMicroelectronics during
his PhD. He is author of several publications and 8 patents in the field of 3D Integration.