This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
- "3D Packaging: A Key Enabler for Further Integration and Performance" on Jan. 23 at 6:30PM
Thibault Buisson, Business Unit Manager, Advanced Packaging, Yole Développement
- Panel session: "How Bringing High Density Interconnect into Production?" on Jan. 24 at 5:30PM
Jean-Christophe Eloy, CEO, Yole Developpement as Moderator