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TSV technology: a key platform for heterogeneous integration
Monday 16 January 2017, 05:00pm
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)

Webcast TSV 646x220

FREE WEBCAST - January 16 at 5:00 PM CET

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PROGRAM :

TSV technology: a key platform for heterogeneous integration
Is 3D TSV only a solution for high end devices? TSV could penetrate the market for devices in high-end graphics, high-performance computing, networking and data centers. However It is also a key enabler for heterogeneous integration in segment such as MEMS & sensors, LED, RF components. What will be the future of this technology?

3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and high performance applications.

In the semiconductor industry, 3D integration using TSV has been considered to be a promising way for improving performance and density. Indeed, by connecting stacked chips with the TSV vertical connections, the wide bandwidth I/O and reduction of interconnects length can be achieved. The market for 3D TSV technology will continue to grow, with a CAGR exceeding 10% over the next five years, helped by the next wave of adoptions, especially with 3D memory devices for high end graphics, high-performance computing, networking and datacenters applications.

The last two years have showed some important changes within the 3D TSV memory market. First commercial products including 3DS DDR4 (Samsung/SK Hynix), HBM (SK Hynix/AMD) and HMC (Micro/Intel) have been released. Then first patent litigations took place between ELM 3DS and leaders such as Samsung Electronics, SK Hynix and Micron Technology. According to Yole Développement, the 3D TSV market for memory applications is showing an impressive CAGR of 43% to 2020, with almost 200 thousands units of wafers in 2016. New products released by the leaders of the microelectronic industry demonstrated the added-value of this innovative advanced packaging platform. The million TSV-based CMOS Image Sensors wafers to be processed in 2017 confirms the tendency of always delivering to the consumer market devices using the most leading-edge technology and manufacturing techniques. The reverse engineering and costing company System Plus Consulting is daily working on these 3D devices to explore the TSV stacked technologies and describe the manufacturing process flow.

By combining their technical expertise and their industrial knowledge, the three companies, Yole Développement, KnowMade and System Plus Consulting, invite you to discover the status of 3D TSV technologies for a wide range of applications.

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Speakers:

EmilieJolivet YOLE2016 Casual BD


Emilie Jolivet, Market & Technology Analyst - Advanced Packaging & Semiconductor Manufacturing, Yole Développement

Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016. 

 


AudreyBastard


Audrey Bastard, Technology & Patent Analyst, Knowmade

Audrey works for Knowmade in the field of Microelectronics and Advanced Packaging. She holds a PhD in Physics from National Polytechnic Institute of Grenoble, France in collaboration with STMicroelectronics, CEA-Leti and CEMES Toulouse. She also holds a Materials Engineering Degree from the Superior Engineering School of Luminy, Marseille, France.

 

 

 

Yannick Levy Parrot - Webcast Sensors for Drones and Robots - Yole Développement
Romain Fraux MEMS Devices, IC’s and Advanced Packaging Project Manager, System Plus Consulting

Romain Fraux is Project Manager for Reverse Costing analyses at System Plus Consulting. Since 2006, Romain is in charge of costing analyses of MEMS devices, Integrated Circuit and Advanced Packaging. He has significant experience in the modeling of the manufacturing costs of electronics components. Romain has a BEng from Heriot-Watt University of Edinburgh, Scotland and a master's degree in Microelectronics from the University of Nantes, France.

 

 

Moderator:

S.LA FERRIERE 025


Camille Veyrier, Marketing & Communication Project Manager, Yole Développement

Since 2009, Camille Veyrier has been one of Yole Développement’s Marketing and Communication Project Managers, in charge of events organization and media product development (websites, e-newsletters, etc.). Camille works closely with Yole Développement’s Corporate Communication department, specifically in the fields of Power Electronics, Advanced Packaging, Compound Semiconductors, LED and Displays. Camille earned a degree in Communication & Marketing from a leading Translation and International Business school in Lyon.

 

 

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