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The promising future of sensors in the Internet of Things
From Monday 03 July 2017
To Tuesday 04 July 2017
Contact Clotilde Fabre (This email address is being protected from spambots. You need JavaScript enabled to view it.)
Fraunhofer Yole 2017 Header

 

Agenda
(soon available)

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Register now


Innovation will drive connected industrial, consumer and automotive sensors into the next era! - The Yole Développement and Fraunhofer EMFT’s seminar

3-4 July 2017 | Munich, Germany

Yole Développement and Fraunhofer EMFT's second MEMS seminar in Munich, Germany, will be dedicated to the critical role of sensors for the success of connected devices in the Internet of Things (IoT). The IoT ecosystem is a complex mix of technologies including devices, modules, connectivity, platforms, storage, servers, analytics software and IT services. Consequently, beyond general framework conditions, trust, security and privacy will be pivotal. Smart sensors embedded in connected devices will become the backbone for a variety of applications from communication, automotive and manufacturing to logistics and health care. The seminar will feature presentations on technology requirements and the latest trends in sensor fusion. It will also discuss production challenges and provide updates on applications for sensors, on the way to the "Next Big Thing".


Learn from an interactive workshop...

  • First Session: INDUSTRIAL IOT - BUILDING AUTOMATION
  • Second session: CONSUMER IOT (health, wearables, connected home...)
  • Third session: CONNECTED MOBILITY
  • Two panel sessions and several networking times!

The agenda is under finalization, and will be annouced soon !

 

For more information, please contact Clotilde (This email address is being protected from spambots. You need JavaScript enabled to view it.)

 

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Location Munich, Germany

Past events



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From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China



Category: MEMS & Sensors

From: Wednesday November 4 To Friday November 6, Location: Paris, France



Category: Advanced Packaging

From: Tuesday October 27 To Tuesday October 27, Location: Orlando, USA



Category: Compound Semi

From: Monday August 31 To Tuesday September 1, Location: Shenzhen, China

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