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Advanced Packaging & System Integration Technology Symposium
From Thursday 20 April 2017
To Friday 21 April 2017
Contact Camille Veyrier (This email address is being protected from spambots. You need JavaScript enabled to view it.)
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Unparalleled gathering of the leading executives from the Advanced Packaging industry! - The Yole Développement and NCAP’s symposium

20-21 April, 2017 | Wuxi, China

For the 3rd time, Yole Développement & NCAP partner to organize the Advanced Packaging Symposium focused on Advanced Packaging & System Integration Technology. This symposium is an unparalleled gathering of the leading executives from around the world discussing the timeliest issues, challenges and opportunities. The unique single-meeting event will take place in one of the most dynamic place in the field of advanced packaging: Wuxi, China, from April 20 to 21, 2017.

During 2 days, all aspects including Fan Out Packaging, System in Package, Advanced Substrates, 3D Technology & Embedded Technologies, as well as MEMS & Sensors packaging, RF, Photonics... will be addressed in one conference, special sessions and key industrial talks.
Also, there will be time for networking and a panel discussion.


Gain an insight into a unique symposium...

  • 5 key industry focuses
  • About 25 inspiring presentations
  • Unique access to leading players and experts
  • 2 panel sessions to debate
  • Several networking times to discuss with your peers

The agenda is under finalization, and will be annouced soon !

 

For more information, please contact Camille (This email address is being protected from spambots. You need JavaScript enabled to view it.)

 

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Location Wuxi, China

Past events



Category: Imaging

From: Thursday September 8 To Thursday September 8, Location: Shenzhen, China



Category: Compound Semi

From: Tuesday September 6 To Wednesday September 7, Location: Shenzen, China



Category: Compound Semi

From: Wednesday May 18 To Thursday May 19, Location: Stockholm, Sweden



Category: Power electronics

From: Wednesday May 11 To Wednesday May 11, Location: Nuremberg, Germany



Category: Advanced Packaging

From: Thursday April 21 To Friday April 22, Location: Wuxi, China



Category: MEMS & Sensors

From: Wednesday November 4 To Friday November 6, Location: Paris, France



Category: Advanced Packaging

From: Tuesday October 27 To Tuesday October 27, Location: Orlando, USA



Category: Compound Semi

From: Monday August 31 To Tuesday September 1, Location: Shenzhen, China

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