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Hitachi Chemical Embedding Insulation Sheet (EBIS): A closer look

At the recent Semicon Taiwan “SiP Global Summit and 3D IC Technology Forum” Toba of Hitachi Chemical described their embedding insulation sheet (EBIS) for FOWLP and FCCSP. I-Mironews thought it was worth…A Closer Look.

The process flow for FO WLP is shown below. They use HD 8940 (a Hitachi/DuPont PBO) as the RDL dielectric.:

Read more: Hitachi Chemical Embedding Insulation Sheet (EBIS): A closer look

Fermilab implements Ziptronix’s DBI hybrid bonding in high-end 3D image sensors

Ziptronix Inc. announced that its Direct Bond Interconnect (DBI®) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Read more: Fermilab implements Ziptronix’s DBI hybrid bonding in high-end 3D image sensors

In the LED packaging world, Flip Chip technology is rising…

4th International LED professional Symposium +Expo (LpS 2014) - From Sept. 30 to Oct. 2nd in Bregenz, Austria

In the LED packaging world, a wind of change is blowing. A LED TV crisis, and new Chinese players have totally modified the LED industry and its supply chain.

Read more: In the LED packaging world, Flip Chip technology is rising…

Plan Optik AG expands its production of QUARTZ WAFERS significantly

Plan Optik AG is expanding its product range in the rapidly growing segment of quartz wafers significantly. In addition to a comprehensive range of standardized processes for wafers in sizes up to 300 mm diameter, customers can order individually configured quartz wafers for special requirements.

Read more: Plan Optik AG expands its production of QUARTZ WAFERS significantly

Akrion Systems will exhibit and present at the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces technical conference

Akrion Systems will exhibit and present two topics at the 12th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) 21-24 September 2014 in Brussels, Belgium.

Read more: Akrion Systems will exhibit and present at the 12th International Symposium on Ultra Clean...

AI Technology, Inc (AIT) develops temporary bonding wax for precision wafer and substrate back-grinding and thinning applications

As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the “thickness” of these devices, and hence, the thickness of the dies and wafers.

Read more: AI Technology, Inc (AIT) develops temporary bonding wax for precision wafer and substrate...

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