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Advanced Semiconductor Engineering (“ASE”) and Siliconware Precision Industries (“SPIL”) announced that the boards of directors of ASE and SPIL have separately passed resolutions for the execution by ASE and SPIL of the “Joint Share Exchange Memorandum of Understanding.” Both companies agree to promote plans for the establishment of a holding company (“HoldCo”). The main terms and purpose of the plans to jointly establish HoldCo are as follows:

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GE Ventures and SHINKO ELECTRIC INDUSTRIES (SHINKO) announced that SHINKO has been granted a patent license and technology transfer of an advanced embedded packaging solution for power electronics called Power Overlay (POL).This patent license and technology transfer deal, signed in early 2015, is a strategic collaboration between GE and SHINKO in both technology and business development.

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MediaTek and NavInfo independently approved the signing of a Strategic Cooperation Agreement and a Framework Agreement by the Board of Directors of each company. Per the Agreements, NavInfo plans to wholly acquire AutoChips, a Chinese subsidiary of MediaTek, for a purchase price of US$600 million.

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Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.

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Note: this is the second part of the whole article. First part is available here. The semiconductor industry is currently sailing through unstable and largely uncharted waters, in search of new applications and supporting technologies that can propel further growth. Smartphones, still the leading semiconductor application, are on the road of maturity, heading towards lower growth rates of ~6% by 2020. Furthermore, front-end device scaling is becoming more complex and deviates from the cost reduction path it followed in the previous decades, according to Moore’s law.

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Note: this is the first part of the whole article. Second part will be released next week. Stay tuned!
The semiconductor industry is currently sailing through unstable and largely uncharted waters, in search of new applications and supporting technologies that can propel further growth. Smartphones, still the leading semiconductor application, are on the road of maturity, heading towards lower growth rates of ~6% by 2020. Furthermore, front-end device scaling is becoming more complex and deviates from the cost reduction path it followed in the previous decades, according to Moore’s law.

Read more ...

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