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Imaging

The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits.

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AMD and Nantong Fujitsu Microelectronics announced that they have closed the transaction to create a joint venture offering differentiated assembly, test, mark, and pack (ATMP) capabilities to both AMD and a broader range of customers.

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UTAC, one of the semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global  manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.

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Most Internet of Things events focus on the software, apps, and networking infrastructure that will connect countless objects and allow them to communicate. But hardware design is often missing from the conversation.

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Amkor Technology, a outsourced semiconductor packaging and test service provider, announced the expansion of its collaboration with Cadence Design Systems to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM™ and SWIFT™ advanced fan-out package technologies.

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An article written by Dick Selwood for EEJournal - Two weeks after the three-ring circus that was embedded world (see "Embedded World Diary"), I was at another event: SEMI's ISS Europe.

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Upcoming Events


> 8TH Fraunhofer IMS Workshop
(May 9 - May 10, Duisburg, Germany)

> 1st Executive Infrared Imaging Forum: From Niche to Large Volume Applications
(September 8 - September 8, Shenzhen, China)