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3D IC and WLP investment rises again

Across the semiconductor industry, front end processes are increasingly being used to provide back-end services. We at Yole Développement have named the providers of such services ‘middle-end foundries’, and believe the trend is very significant. Most devices use flip-chip technologies. Memory is now adopting wafer-level packaging (WLP) in very large volumes and through-silicon vias (TSVs) in high-end applications.

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European 3D TSV Summit: A "must-attend" event for anyone involved in 2.5 and 3D integration

An unrivaled conference program featuring influential keynote and invited speakers.

Keynotes:

Die Stacking Is Happening
Bryan Black, Senior Fellow
AMD

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TSV integration is creating growth and significant interest in the equipment & materials industry

“The long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms” says Yole (Yole Développement) in its latest report, Equipment & Materials for 3DIC & WLP Applications.

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Borofloat®33 Wafers now available from stock

Plan Optik AG, the leading manufacturer of glass wafers, expands its production of blank Borofloat®33 substrate wafers immensely. In response to the high demand of stock wafers, Plan Optik has enlarged its capacity in sizes from 100 up to 300 mm diameter and in various thicknesses and roughness.

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Sony announces the Exmor RS™, the industry's first*1 stacked CMOS image sensor with an image plane phase detection signal processing function for high-speed AF

Sony Corporation (hereafter "Sony") announces the commercialization of the Exmor RS™ IMX230 for smartphone cameras and other devices requiring increasingly sophisticated image-capture functionality.

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UTAC introduces new grid array QFN package for high density applications

UTAC Holdings Ltd (UTAC), a Singapore-based semiconductor testing and assembly services provider, today announced that its new Grid Array Flat No-Lead (GQFN) package has received customer qualification and is moving to high volume production in Thailand in 1Q15.

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