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Imaging

Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR  during this period.

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Sarda’s Heterogeneous Integrated Power Stage (HIPS) employs UTAC’s 3D SiP using the Embedded Component Packaging (ECPâ) Technology from AT&S for granular power delivery.

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Samtec, a provider of high bandwidth and micro-pitch interconnect systems, announced the acquisition of nMode Solutions, of Oro Valley, Arizona.

The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is a critical next step in Samtec’s technology roadmap.

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On April 21st and 22nd, the National Center for Advanced Packaging (NCAP China) and Yole Développement (Yole) held the 2016 Advanced Packaging and System Integration Technology Symposium. This follows the successful inaugural meeting held in 2014, and underlines the promise of the collaboration between the two organizations that has flourished in the time since.

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We have been hearing about the drilling and filing of silicon TSV for more than a decade, but every once and awhile a new approach comes along. Professor Kazuo Kondo from the Osaka Prefecture University works in the Small Feature Electrodeposition Laboratories and has been looking to reduce the cost of copper electrodeposition in silicon TSV. i-Micronews thought Kondo-sans work was worthy of… a closer look.

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Hynix, Amkor and their partners eSilicon, Northwest Logic and Avery Design recently held a seminar to explain how the HBM supply chain works. iMicronews through it was worth – A closer look.

High Bandwdth memory (HBM) is a JEDEC defined memory architecture that connects stacked DRAM through the use of TSV. It is currently being integrated with other logic die using 2.5D interposer technology. In addition to GPUs (graphics modules) HBM is being adopted by HPC (high performance computing), data centers and networking applications.

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