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Imaging

Leuven (Belgium)- At the 2017 European 3D Summit in Grenoble (France, Jan 23-25), the world-leading research and innovation hub for nano-electronics and digital technology imec and the leading supplier of wafer-bonding equipment EV Group (EVG) announce an extension to their successful collaboration, achieving excellent wafer-to-wafer overlay accuracy results in both hybrid bonding and dielectric bonding. Expanding this collaboration, EVG will become a partner in imec's 3D integration program through a joint development agreement to further improve overlay accuracy in wafer-to-wafer bonding.

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3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back.

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At the recent IMAPS 3D ASIP conference Amkor Technology (Amkor)’s Mike Kelly, Sr. Director of Advanced packaging, updated their status on their advanced packaging options. i-Micronews.com thought it was worth… a closer look.

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The new three times larger laboratory equipped with cutting-edge equipment will open in Shin-Kawasaki. Hitachi Chemical announces the relocation of its Open Laboratory (Tsukuba, Ibaraki Prefecture) to Kawasaki City (Shin-Kawasaki), Kanagawa Prefecture, in order to strengthen the laboratory’s functions.

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Plasma-Therm has been selected by the ASE Group (Advanced Semiconductor Engineering) to provide plasma dicing capability at their Chung-Li, Taiwan facility. The Plasma Dicing on Tape (PDOT) production system will be available for customer demonstrations, development and prototyping in early 2017.

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Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC  package substrate came from DC/DC  converters in smartphones, penetration in other market segments of interest to embedded die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles.

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