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KLA-Tencor introduces new portfolio for advanced semiconductor packaging

CIRCL-AP™ and ICOS®  t830 support advanced packaging from wafer-level to final component

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Advanced WLP at Amkor: a closer look

From Dr. Phil Garrou for Yole Développement - At the recent IMAPS Device Packaging Conference Amkor gave several papers defining their Advanced WLP Positioning. Both SWIFT (Silicon Wafer Integrated Fan Out Tech) and SLIM (Silicon less integrated module) are high density packages fabricated without TSV technology and thus can be viewed as alternatives to 2.5/3DIC. i-Micronews thought they were worth... a closer look .

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A*STAR's IME and Industry Partners to enable high density/low-cost packaging technology for system scaling within smart devices

New capabilities in high-density fan-out wafer level packaging will heighten system performance in smart devices

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Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology for its SmarTune RF MEMS tuners

Innovative RF MEMS antenna tuners leverage advanced wafer level packaging to provide OEMs with high quality chip scale packages.

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SEMI Seminar focuses on european packaging, assembly and test

On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal. Organized by SEMI Europe, the event will be hosted by NANIUM S.A., Europe’s leading Outsourced Semiconductor Assembly and Test (OSAT).

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Altera and TSMC innovate industry-first, UBM-free WLCSP packaging technology platform for MAX 10 FPGA products

Companies Extend 55nm Embedded Flash Collaboration with Unique Packaging Innovation.

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UPCOMING EVENTS


> International Image Sensor Workshop (IISW)
(June 8 - June 11, Vaals, Netherlands)

> Image Sensors America
(September 8 - September 10, San Francisco, USA)
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