Imaging

IMAPS France will hold the 3rd edition of the Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Application on November 25-26 at the Lyon Metropole Hotel in Lyon, France.  

Read more ...

Reduced footprint of Dual Cool™ 88 MOSFET boosts power density and improves system efficiency with a low parasitic package

Read more ...

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it garnered a 2015 3D InCites Award for new Dow Corning®TC-3040 Thermally Conductive Gel, a silicone-basedthermal interface material (TIM 1) designed to manage heat and support reliable performance for advanced semiconductor flip chip applications. Selected by a panel of 12 judges from industry, academia and the technical

Read more ...

Deal Augments Tessera's 3D-IC Capabilities in Rapidly Growing Market Ziptronix Technologies Currently Deployed in $8 Billion Image Sensor Market

 

Read more ...

Toshiba’s recent announcement of TSV based NAND stacking should be considered in light of other announcements on monolithic vertical NAND stacking  by Samsung, Toshiba/Sandisk, Intel/Micron and Hynix. I-Micro thought this was worth ….a closer look.

Read more ...
Toshiba Corporation (TOKYO:6502) today announced the development of the world’s first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.
Read more ...

Upcoming Events


> Image Sensors America
(November 17 - November 19, San Francisco, USA)