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Kyocera APX- An advanced organic technology for 2.5D interposers: a closer look

From Phil Garrou for Yole Développement. In 2003 Kyocera, traditionally an advanced ceramics manufacturer, acquired the Surface Laminar Circuitry (SLC) business from IBM Japan and formed Kyocera SLC Technologies Corp. devoted to developing high-density wiring boards for servers and network equipment and high density substrates for flip chip BGA packages.

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Orbotech announces collaboration between SPTS Technologies and Fraunhofer IZM to advance process development of wafer level packaging of microelectronic devices

Fraunhofer IZM selects SPTS’ DRIE and low temperature CVD to develop next generation manufacturing techniques.

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What does 3D integration have in store for semiconductor and related industries in 2015?

Yole Développement invites you to discover the main technology trends and business opportunities for 3D integration in 2015.

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NANIUM presents the most compact eWLB-based 10 chip array in the medical market

NANIUM S. A., acknowledged for its semiconductor packaging proficiency, today presented a solution that integrates 10 dies side-by-side in a 2 x 5 array.

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Amkor Technology announces comprehensive settlement with Tessera

Amkor Technology, Inc. (NASDAQ: AMKR) announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

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Infineon Technologies AG successfully acquires International Rectifier

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced today the closing of the acquisition of International Rectifier. With effect from today, the El Segundo based company has become part of Infineon following the approval of all necessary regulatory authorities and International Rectifier’s shareholders.

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SEMICON EUROPA
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( March 17 - March 20, London, UK )
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