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Imaging

Tutorials are filling-up. Register quickly: www.estc2016.eu. The 6th edition of the Electronics System Technology Conference (ESTC) will be held at the World Trade Center in Grenoble, France from September 13-16, 2016. Registration and program information are on conference website www.estc2016.eu. The event will feature five keynote addresses, five tutorials, over 140 conference papers and posters in 32 technical sessions, with participants coming from 28 different countries. There will also be three special session and a vendor exhibition with 40 exhibitors.

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At the recent ECTC Conference in Las Vegas start-up X-Celeprint presented 4 papers on their Micro-Transfer-Printing, μTP, process and how it can be applied to various aspects of microelectronics. The μTP technology is an advanced assembly technology which allows the accurate movement of hundreds of small (sub mm is their sweet spot) devices at a time. I-Micronews.com thought it was worth… a closer look.

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Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

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Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

A*STAR‟s Institute of Microelectronics (IME) has launched two consortia on advanced packaging, the Silicon Photonics Packaging consortium (Phase II) and the MEMS Wafer Level Chip Scale Packaging (WLCSP) consortium.

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High Accuracy Inkjet Printing of 3D Underfill Dams Offers Greater Flexibility and Lower Cost of Ownership in Volume Production

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Rudolph Technologies, a designer in, development, manufacture and support ofdefect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated solution consisting of multiple process control inspection systems and yield management software suite.

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Upcoming Events


> 1st Executive Infrared Imaging Forum: From Niche to Large Volume Applications
(September 8 - September 8, Shenzhen, China)

> AutoSens
(September 20 - September 22, Brussels, Belgium)