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Will embedded die be the next packaging platform?

Embedded die for passive and active devices is already a market with several players, from AT&S in Europe to TDK in Japan and several other PCB makers looking at the business opportunities. In the latest report "Fan-Out and Embedded Die: Technologies & Market Trends", Yole Développement analyzed in details the potential growth of such embedded die market and also how companies are using such technology to change their business models: AT&S is developing an OSAT business model compared to TDK which is proposing modules using its embedded process to move higher in the value chain.

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Attend IMAPS France MiNaPaD Forum on April 21-23

The 4th edition of the Micro/Nano-Electronics Packaging and Assembly Design and Manufacturing Forum (MiNaPaD) will be held at the World Trade Center (WTC) in Grenoble from April 21-23, 2015. The final program, registration and conference information are available on the website.

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Ziptronix licenses DBI® hybrid bonding patents to Sony for advanced image sensor applications

Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, announced a patent licensing agreement with Sony Corporation for application in advanced image sensors. The agreement marks the continued adoption of Ziptronix's hybrid bonding patents for high volume applications.

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Rudolph JetStep lithography system gains traction for advanced packaging applications

Tool to be used for development of copper pillar bumping and TSV processes.

Rudolph Technologies, Inc. (NYSE: RTEC) announced that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.

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ASE Fan Out Chips Last Packaging (FOCLP): A closer look

From Phil Garrou for Yole Développement. At the recent IMAPS Device Packaging Conference in Ft McDowell AZ ASE described their FOCLP (fan out chips last package) a new low cost packaging option that requires no wafer fab infrastructure. i-Micronews thought it was worth... A closer look.

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How Sony survived disruption and leapt into the future

Yole Développement recently launched the 2015 market and technology report entitled ‘Status of the CMOS Image Sensor Industry’. This report analyses the recent trends that are reshaping this industry. Sony has excelled in mobile photography and therefore captured a quarter of the global image sensor market. Yole Développement had a great opportunity in interviewing Mr Yasuhiro Ueda, SVP Corporate Executive, Senior General Manager of the Image Sensor Business Division of Sony Corporation to find out more about the future of Sony and of CMOS Image Sensors in general.

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