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Thermo-oxidative stability of EMCs… a closer look

At the recent IEEE ECTC conference in SanDiego, Lakhera and co-workers from Freescale examined warpage in ultrathin molded array packages under high temp storage life (175 °C). The results pointed to thermo-oxidative stability issues for standard molding compounds (EMCs). iMicronews thought it was worth….a closer look.

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Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via-middle TSV

System Plus Consulting, sister company of Yole Développement (Yole), released this month its new reverse costing report, Samsung 3D TSV stacked DDR4 DRAM. In August 2014 Samsung announced the mass production of the first analyzed 3D TSV technology based DDR4 modules for enterprise servers. According to Samsung, this new module, because of its high density and high performance will play a key role in supporting the enterprise servers’ development and cloud-based applications, as well as further diversification of data center solutions.

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Evolving Technologies Summit focuses on alternate alloys and wearable electronics at SMTA International

The SMTA announced that the Evolving Technologies Summit will be held on September 28, 2015 as a focused symposium at SMTA International in Rosemont, Illinois. The purpose of the summit is to present the key issues in Printed Electronics, Advanced Packaging Technology, and Materials Innovations in order to gain insight regarding technology changes in the future.

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GLOBALFOUNDRIES, Director, Package Architecture & Customer Technology (PACT) Rama Alapati to Keynote IWLPC 2015

Conference: High Density Fan-Out: Evolution or Revolution

Continued form factor and IO density scaling pressures have necessitated innovation in wafer level packaging technologies including High Density Fan-Out at leading edge Si nodes.

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Invensas VP, Arkalgud, to Keynote Second Day of IWLPC

Conference: 2.5D/3D IC – Examining Low Cost Alternatives - Wednesday, October 14, 2015

2.5D and 3D products have entered the semiconductor market, albeit at the higher end of performance and pricing. The penetration has been slow, primarily due to the high cost of Si interposer technology, and, consequently, new TSV-less technologies have recently been proposed.

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Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.”

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UPCOMING EVENTS


> Image Sensors America
(November 17 - November 19, San Francisco, USA)
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