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3D ASIP 2014 agenda announced

3D ASIP Conference explores technology progress and market opportunity for 3D semiconductor integration and packaging, from memory to heterogeneous systems and IoT.

The full agenda for the 2014 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) conference has been released.


EV Group unveils room-temperature covalent bonder for engineered substrate and power device production applications

EVG®580 ComBond® integrates advanced surface preparation processing to ensure oxide-free bonds and higher device yields.

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®-a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.


EV Group Next-Gen nanoimprint lithography technology targets photonics, LED and bioengineered device production

SmartNIL™ large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches.


SUSS MicroTec launches SB6/8 Gen2: a next-generation semi-automated permanent wafer bonder

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder. The semi-automated SB6/8 Gen2 is SUSS MicroTec’s state-of-the-art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.


Lam research ships 100th syndion® etch module

Milestone Highlights Lam's Leadership for Deep Silicon Etch and Signals Momentum for Emerging TSV Applications.

Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, announced it has shipped the 100th Syndion® module for deep silicon etch applications, including CMOS image sensors (CIS), interposers, and through-silicon vias (TSVs). Lam's production-proven 2300® Syndion® product family is the etch market leader for manufacturing advanced CIS chips, which are used in mobile, automotive, and medical devices. The systems are also used to create TSVs for stacked memory and other three-dimensional integrated circuits (3D ICs). To enable the transition of 3D ICs from development to high-volume production, Lam's Syndion products provide industry-leading performance in etch uniformity, profile control, and productivity. As a result, Syndion is the development tool of record for TSV etch with the majority of leading IC manufacturers worldwide.


Advanced packaging technologies are changing the LED manufacturing supply chain

Last month, Yole Développement (Yole) announced the update of its technology and market analysis, LED Packaging Technology & Market Trends. Under this new report, the research market and strategy consulting company highlights the impact of advanced packaging technologies in the LED industry. “The combination of cost reduction and advanced packaging technologies such as Flip Chip and Chip Scale Package, is changing the LED industry landscape, especially its supply chain”, announces Yole.



( October 7 - October 9, Grenoble, France )