Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Imaging

A10 SystemPlus SEpt2016System Plus Consulting will soon release a complete report on TSMC’s Integrated FanOut (inFO) technology used for Apple’s A10 processor packaging. Featured in the latest Apple iPhone 7, the processor has higher performance, higher thermal dissipation, larger area, and lower power consumption compared to the previous generation A9 – and is much thinner. 

Read more ...

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes. Rudolph Technologies, launched two new inspection and metrology solutions for advanced semiconductor manufacturing: the Firefly™ System for high-resolution inspection in front- and back-end applications, and the Dragonfly™ System for high-speed two-dimensional (2D) inspection in advanced packaging processes. Both systems leverage newly designed optical and imaging systems optimized for defect type, size, and maximum throughput.

Read more ...

SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, announced the launch of its new generation of the fully automated ACS300 platform. The modular system of the ACS300 Gen3 is specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip and 3D packaging.

Read more ...

Applied Materials, and the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), announced a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices smaller, faster and more power efficient.

Read more ...

High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive. Santa Clara, Calif., GLOBALFOUNDRIES introduced a scalable, embedded magnetoresistive non-volatile memory technology (eMRAM) on its 22FDX platform, providing system designers with access to 1,000x faster write speeds and 1,000x more endurance than today’s non-volatile memory (NVM) offerings. 22FDX eMRAM also features the ability to retain data through 260°C solder reflow, industrial temperature operation, while maintaining an industry-leading eMRAM bitcell size.

Read more ...

SPTS’s Rapier-300S plasma dicing solution to bolster Novati’s Foundry Services at Texas fab. SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, announced its collaboration with Novati Technologies, a global nanotechnology development center, to establish Novati’s new plasma dicing line at their state-of-the-art fab in Austin, Texas. Novati has selected SPTS’s Rapier-300S plasma dicing solution over competing options to provide next-generation plasma dicing capabilities and services for customers.

Read more ...

Upcoming Events


> Semi Webinar: Why are Imaging Semiconductors keeping such high momentum?
(September 28 - September 28, on your computer)