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Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

Amkor Technology, Inc., a leading provider of semiconductor assembly and test services, announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology. The agreement provides for the transfer of Amkor's copper pillar wafer bump technology to GLOBALFOUNDRIES and a license under Amkor's intellectual property to enable GLOBALFOUNDRIES to bump wafers based on this technology.

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Powertech Technology announces agreement with Micron Technology for assembly and packaging services in China

Powertech Technology Inc. (PTI) (6239. TW), a leading supplier of integrated circuit (IC) backend services, and Micron Technology, Inc. (Micron) (NASDAQ: MU), announced that they have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services in Xi'an, China.

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IMAPS France MiNaPaD Forum April 22-23 - Call for Papers

IMAPS France announces the 4th edition of the Micro/Nano-Electronics Packaging and Assembly Design and Manufacturing Forum (MiNaPaD) to be held at the World Trade Center (WTC) in Grenoble from April 21-23, 2015. The deadline for abstract submission is January 30.

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A 3D TSV webinar in connection with the European 3D TSV Summit

In connection with the European 3D TSV Summit, a dedicated 3D TSV Webinar will take place on Thursday December 11, 2014, at 16:00 CET.

The Webinar will host three experts to talk about both the market outlook and the technological advances being made in the domain of 3D-IC.

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TSV based memory going to volume production: the era of 3DIC finally begins

Many expect current DDR, both the compute variety (DDR3 / DDR4) and the mobile variety (LPDDR3/LPDDR4) to reach the end of their road soon, as the DDR interface reportedly cannot run at data rates higher than 3.2 Gbps in a traditional computer main memory environment. Thus several new DRAM memory architectures based on 3D layer stacking and TSV have evolved to carry memory technology forward.

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