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2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC changed the game and may create a trend of acceptance of Fan-Out packages.

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Development of low-cost WLCSP for large die with high I/O count is desired for broadening its applications. Reliability issues including solder cracking and high chip warpage are known to be the main challenges for extending the die size of conventional WLCSP to more than 5x5 mm2 with ball pitch smaller than 350 um.

At the ECT conference in Las Vegas TSMC discussed UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables such large die fine pitch packages. 

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Samsung Electronics, the world leader in advanced memory technology, today introduced a blueprint for next-generation flash memory solutions that will meet the ever-increasing demands of big data networks, cloud computing and real-time analysis.

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At the IEEE ECTC Conference in Las Vegas Mike Ma of Siliconware gave the presentation “The development and technological comparison of various die stacking and integration options with TSV Si interposers”. i-Micronews thought it as worth... A Closer Look.

There are four main stacking platforms for 2.5D IC in advanced packaging.

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Micron Technology, introduced the company's first 3D NAND memory technology optimized for mobile devices and its first products based on the Universal Flash Storage (UFS) 2.1 standard. Micron's initial mobile 3D NAND-based 32GB solution is targeted specifically for the high and mid-end smartphone segments which make up approximately 50 percent of worldwide smartphone volume. As mobile devices bypass personal computers as consumers' primary computing device, user behaviors heavily impact the device's mobile memory and storage requirements. Micron's mobile 3D NAND addresses these concerns, enabling an unparalleled user experience that includes seamless high definition video streaming, higher bandwidth gameplay, faster boot up times, camera performance and file loading.

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Final announcement – Registration at
The 6th edition of the Electronics System Technology Conference (ESTC) will be held 13 – 16th of September, 2016, at the World Trade Center in Grenoble, France. This international event brings together both academic as well as the industry leaders to discuss and debate about the state-of-the-art and future trends in packaging and integration technologies.

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Upcoming Events

> 1st Executive Infrared Imaging Forum: From Niche to Large Volume Applications
(September 8 - September 8, Shenzhen, China)

> AutoSens
(September 20 - September 22, Brussels, Belgium)