Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Imaging

Qualcomm announced that its subsidiary, Qualcomm Technologies and Samsung Electronics have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies’ latest Snapdragon premium processor, Qualcomm® Snapdragon™ 835, with Samsung’s 10-nanometer (nm) FinFET process technology.

The decision to use Samsung’s cutting edge process in the next generation premium processor highlights Qualcomm Technologies’ continued dedication in being the technology actor in mobile platforms.

Read more ...

Building on a record of past successes, SEMI today announced the fifth SEMI European 3D Summit. The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme “European 3D Summit 2017 – Creating High Density Systems.”

Read more ...

Within a highly competitive landscape due to a strong price pressure, most of the LED  companies are looking for business opportunities and adopt different strategies of development. Vertical integration, product, application and activity diversification… New relays of growth are required for LED players to survive.

Read more ...

In the fast-growing Fan-Out market showing 80% increase between 2015 and 2017 , it is today essential to deeply understand the patent strategies of the key players.
The Technology Intelligence & IP  Strategy Company, KnowMade has thoroughly investigated the Fan-Out packaging patent landscape and releases today the new patent landscape analysis titled Fan-Out Wafer Level Packaging.

Read more ...

MediaTek, a global semiconductor actor, announced its plan to bring holistic, fully integrated system solutions to the automotive industry beginning Q1 2017. The market for connected and autonomous vehicles continues to grow, and the automotive industry and car-makers demand advanced technologies equipped with a blend of power-efficiency, processing power and affordability. MediaTek’s technology expertise in chipset design - for mobile, home entertainment, connectivity and IoT - positions the company well to bring innovative multimedia, connectivity and sensor solutions to the automotive industry.

Read more ...

Fan-In packaging has been a successful and steadily growing platform for over a decade. However Fan-In packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite of unchanged market drivers, Fan-In packaging is showing an uncertain future with a slowing down smartphone market and the growing adoption of SiP  technologies. The integration of Fan-In functions in SiP could disrupt the Fan-In market.

Read more ...

Upcoming Events

No events

Presentation

Key technologies for the ADAS vision sensor market
Discover the presentation held by Pierre Cambou at Autosens, the 21th of September in Brusse...
Imaging Market Webcast
Discover the presentation held by Pierre Cambou during a Webinar hosted by Semi on Imaging, ...
Sensing for Imaging to Imaging for Sensing
Discover the presentation held by Pierre Cambou on Fraunhofer IMS Workshop, in Germany, the ...

Access to all our presentations