SEARCH
Search Micronews, MEMSentry, Proceedings, Reports
Member Sign In
Email:  
Password:   
Subscribe to Micronews and Newsletters Help?
  July 24th - 03:31 am
RSS FEEDS ARCHIVES EXHIBITIONS CONTACTS REPORTS CAREERS MEMSENTRY
C O N T E N T S
 MEMS
        > Techno
        > Business/Market
        > Corporate/Finance
        > Equipment
 
  MEMSentry
 COMPOUND SEMI
        > Materials & Equipment
        > Optoelectronics
        > RF electronics
        > Power electronics
 PHOTONICS
 MICROFLUIDICS
 PHOTOVOLTAIC
 IC MANUFACTURING
 ADVANCED PACKAGING: 3D IC, WLP & TSV
 NANOMATERIALS

 I-Micronews Partners

    > Mission

    > Services
       General Overview

    > Services
       Strategic Consulting

    > Services
       Market Research

    > Services
       Multi Customer Action

    > Methodology

    > Location

    > Contacts
 Our prices and table of contents are subject to change without any notice.
Please check available prices
when you order.
  >  TOP STORY
COMPOUND SEMI
OSRAM has achieved 136 lm/W white LED at 350mA
By improving all the technologies involved in the manufacture of LEDs, OSRAM development engineers have achieved new records for the brightness and efficiency of white LEDs in the laboratory. Under standard conditions with an operating current of 350 mA, brightness peaked at a value of 155 lm, and efficacy at 136 lm/W. White prototype LEDs with 1 mm2 chips were used.  The light produced had a...
  >  INTERVIEW
IC MANUFACTURING
Through continuous innovation, EVG is well determined to keep its leadership position for the next years
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, MEMS...
  >  NEW YOLE REPORT
 
Picoprojectors and Light Engines 2008 report
Discover the new “Picoprojectors & Light Engines 2008 report” from Yole. The new Yole report “Light engines and pico-projectors markets” is an update of our 2007 version and will give a market description for every application requiring a mixed approach with MEMS and Solid State Lighting: RPTV, pico-projectors, HUDs, HMDs, barcode readers and micro spectrometers.
LATEST REPORTS
ADVANCED PACKAGING: 3D IC, WLP & TSV : 3D-TSV Interconnects - 2008 Report
ADVANCED PACKAGING: 3D IC, WLP & TSV : 3D TSV Interconnects - Devices & Systems 2008 Report
ADVANCED PACKAGING: 3D IC, WLP & TSV : 3D TSV Interconnects - Equipments & Materials 2008 report
PHOTOVOLTAIC : PV Fab Database 2008
  >  Yole Index


To get the latest quotations from companies composing Yole Index, please download the Excel file
 
  >  Articles TOP 10
 
Click here to see the 10 most read articles
 
  >  NEWS FROM THE PUBLISHER
 
 PV Manufacturing Newsletter
Discover the first issue of our PV manufacturing Newsletter
 
 3D Packaging News
Download July 2008 issue
 
 Reports
Visit our Reports section and see what are Yole's latest releases
 
 MEMS Techno
Chipworks New ICInside Surveyor™ – Putting a Virtual SEM on Your Desktop, Accelerating the Use of ...
 
 
 MEMS Business/Market
Invensense™ IDG-600 motion sensing solution showcased in Nintendo's new Wii MotionPlus accessory...
 
 
 MEMS Corporate/Finance
APM announces alliance agreement on 8-inch MEMS Fab with UMC...
 
 
 MEMS Equipment
SVTC Technologies selects processing tools from SUSS MicroTec...
 
 
 COMPOUND SEMI Materials & Equipment
Purdue develops a "metallized" silicon substrate to replace Sapphire for GaN LED manufacturing....
 
 
 COMPOUND SEMI Optoelectronics
OSRAM has achieved 136 lm/W white LED at 350mA...
 
 
 COMPOUND SEMI RF electronics
Mimix Broadband Receives $10M of New Investment from GaAs Labs...
 
 
 COMPOUND SEMI Power electronics
Infineon powers Chinese hybrid cars ...
 
 
 PHOTONICS 
Optical interconnects startup raises funds...
 
 
 MICROFLUIDICS 
Caliper Life Sciences introduces Labchip GX and GXII microfluidic instruments to address specific ...
 
 
 PHOTOVOLTAIC 
Applied Materials Breaks Ground for Taiwanese Manufacturing Center Expansion ...
 
 
 IC MANUFACTURING 
UMC announces restructuring of executive team ...
 
 
 ADVANCED PACKAGING: 3D IC, WLP & TSV  
Vertical Circuits & Asymtek Enable Next-Generation 3D Interconnect Technology...
 
 
 NANOMATERIALS 
Using nanotechnology to create high-performance materials...
 
  >  TO MEET WITH US
 
  MEMS
> Micromachine/MEMS 2008 (July 30 - August 1, Tokyo, Japan)
> COMS 2008 (August 31 - September 4, Mexico, Mexico)
  NANOMATERIALS
> Nanotech Northern Europe 2008 (September 23-25, Copenhagen, Danemark)
  COMPOUND SEMI
> IWN 2008 (October 6-10, Montreux, Switzerland)
  ADVANCED PACKAGING: 3D IC, WLP & TSV
> Semicon Europa 2008 (October 7-9, Stuttgart, Germany)
> IWPLC 2008 (October 13-16, San Jose, CA)
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: 45 rue Sainte Geneviève, F-69006 Lyon, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr