> tecnisco Ltd., .

Phone: +81-3-3472-6991 www.tecnisco.co.jp/en/index.php o-sales@tecnisco.co.jp

Can you introduce tecnisco to the readers?

We, tecnisco, are micro processing service provider and have founded since 1970. We are a member of Disco corporation who is world leading dicing and grinding equipment maker. Our core technology is based on the CNC machining. In 2003, we have succeeded to develop high throughput drilling tool for glass. And it made possible to process any glass materials 2 to 3 times faster than conventional drill. We have supplied high quality structured glass wafer that is specially designed for MEMS device since 2003 by our accumulated various processing know how and CNC machining technology. Recently, we also supply bland new products named transparent bottom (mirror surface cavity bottom) wafer/chip to biomedical and LED market. (Figure 1) We have a lot of experiences to support our customer’s product development project from prototype to mass production as a reliable partner. We also have founded new factory for glass production in Suzhou China since 2006 in order to meeting increasing market demand. The number of staff has been total 200.

 

Can you elaborate on the applications where tecnisco’s product used today?

Our products mainly used as spacer, interposer and lid for MEMS sensor for automobile, lens module for CMOS imager, inspection equipment and display device. We also released microfluidic chip (Figure 2) recently that is used as DNA analysis, protein analysis and drug screening. Our microfluidic chip is made by glass and it has metal conductive via and metallization pattern. That’s why it has excellent transparency, heat proof and chemical proof. As these transparency and conductivity, our customer can analyze objects by both optically and electrically. Normally, glass-made microfluidic has only few tens micron depth channels, however, our glass-made microfluidic has much deeper channels over few hundreds micron.

 

What is the main advantage using your glass to MEMS devices?

Our structured glass wafer is chosen from our customers by the following advantages. 1 - Accurate shape and pitch tolerance, narrower pitch and smaller hole. 2 - Non-tapered straight hole shape. (Figure 3) 3 - Less chip out (under 5um) and non-slope around hole edge process. 4 - Smoothing treatment inside processed surface for fewer particles (Figure 4) 5 - Metallization on the glass. (Cr, Ti, Pt, Au, Cu, AuSn etc) 6 - Up to 12 inches wafer capability. 7 - Flexible capacity from prototype to mass production.

 

Over the medium term, what will be the next key step for tecnisco?

We think that market demands are high precision and integration process. And filled metal via wafer (Figure 5) has got highly required too. We have already supplied filled metal via wafer to some customers but our goal is succeeding to develop much denser via wafer and expand to several markets such as RFMEMS and biomedical market and so on. We are interested in new materials processing such as SiC and Sapphire too. Currently, we are already processing SiC and Sapphire materials in small volume. We keep a close eye on the new materials trend. We continue to supply high quality and excellent value to the market with our various cutting-edge processing technologies.