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Feb 1st, 2013
Besi: Datacon 2200 evo
BE Semiconductor Industries N.V., Besi, a leading manufacturer of assembly equipment for the semiconductor industry, announces the shipment of the 1,000th unit of its Multi-Chip Die Bonder Datacon 2200 evo. The 2200 evo bonder is a high-performance Die Attach and Flip Chip assembly equipment; it handles an extremely wide variety of products with high yield and low cost-of-ownership.
“While we have already sold hundreds of the Datacon 2200 machine platform, the 2200 evo is by far the most successful machine in this series.” says Peter Wiedner, SVP of the Besi Die Attach Group, as he unveils the success secret of the bonder. “The 2200 evo provides unbeaten fl exibility and an open platform architecture that exactly adapts to all customer requirements. Having manufactured Multi-Chip, Multi-Module Attach systems for many years, we have combined all our technological experience and market knowledge in the development of the 2200 evo.”
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