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Apr 6th, 2013
A*STAR and UTAC to develop 2.5D TSI platform
A*STAR’s Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC), an outsourced assembly and test (OSAT) provider, collaborate on the development of a 2.5D Through-Silicon-Interposer (TSI) platform.
This collaboration builds on the technology expertise of both partners and leverages IME’s cutting-edge 300mm Through-Silicon-Via (TSV)/TSI fabrication and assembly infrastructure to develop and prototype 2.5D TSI-based systems. IME will contribute its deep R&D experience in design and advanced packaging to develop optimized solutions to address electrical, thermal, thermo-mechanical and reliability requirements for applications including mobile devices such as tablets and smart phones. The optimized 2.5D TSI technology from this collaboration will be transferred to UTAC for high volume manufacturing, enabling UTAC to shorten their time-to-market significantly.
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