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May 3rd, 2013
 
TriQuint achieves breakthrough GaN-on-Diamond results
 
Enables high performance, low heat operation, significantly smaller transistors.
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TriQuint Semiconductor, Inc.(NASDAQ: TQNT), a leading RF solutions supplier and technology innovator, today announced that it has produced the industry's first gallium nitride (GaN) transistors using GaN-on-diamond wafers that substantially reduce semiconductor temperatures while maintaining high RF performance. TriQuint's breakthrough technology enables new generations of RF amplifiers up to three times smaller or up to three times the power of today's GaN solutions. Read DARPA's associated release.

TriQuint received a Compound Semiconductor Industry Award in March commending its new GaN-on-diamond achievements. TriQuint's James L. Klein, Vice President and General Manager for Infrastructure and Defense Products, remarked that unlocking the true potential of high-efficiency GaN circuits will depend on achievements like those of TriQuint's advanced research and development program.

Operating temperature largely determines high performance semiconductor reliability. It's especially critical for GaN devices that are capable of very high power densities. "By increasing the thermal conductivity and reducing device temperature, we are enabling new generations of GaN devices that may be much smaller than today's products. This gives significant RF design and operational benefits for our commercial and defense customers," he said.

TriQuint demonstrated its new GaN-on-diamond, high electron mobility transistors (HEMT) in conjunction with partners at the University of Bristol, Group4 Labs and Lockheed Martin under the Defense Advanced Research Projects Agency's (DARPA) Near Junction Thermal Transport (NJTT) program.

NJTT is the first initiative in DARPA's new 'Embedded Cooling' program that includes the ICECool Fundamentals and ICECool Applications research and development engagements. NJTT focuses on device thermal resistance 'near the junction' of the transistor. Thermal resistance inside device structures can be responsible for more than 50% of normal operational temperature increases. TriQuint research has shown that GaN RF devices can operate at a much higher power density and in smaller sizes, through its highly effective thermal management techniques.

TriQuint's new GaN achievement in detail

TriQuint's breakthrough involves the successful transfer of a semiconductor epitaxial overlay onto a synthetic diamond substrate, providing a high thermal conductivity and low thermal boundary resistance, while preserving critical GaN crystalline layers. This achievement is the first to demonstrate the feasibility of GaN-on-diamond HEMT devices. Results to date indicate TriQuint achieved the primary NJTT goal of a three-fold improvement in heat dissipation while preserving RF functionality; this achievement supports reducing power amplifier size or increasing output power by a factor of three. Additional fabrication improvements and extensive device testing are underway to optimize the epitaxial layer transfer process and fully characterize enhancements that can be achieved in these new HEMT devices.

TriQuint Gallium Nitride Product Innovation, Honors & Resources:
Heritage
Leader in defense and commercial GaN research since 1999
Research
Leader in performance and reliability GaN development
University Partners
Massachusetts Institute of Technology, University of Notre Dame, University of Colorado at Boulder and University of Bristol
The Global GaN Impact
Strategy Analytics recognizes TriQuint's GaN R&D / GaN Product Innovation
Active R&D Programs
DARPA NEXT program for highly complex, high frequency GaN MMICs
Defense Production Act (DPA) Title III program for GaN on SiC; Radar and EW MMICs: Air Force and Navy sponsors
DARPA Microscale Power Conversion program to develop ultra-fast power switch technology and integrate technology into next-generation amplifiers
DARPA Near Junction Thermal Transport (NJTT) GaN program to increase circuit power handling capabilities through enhanced thermal management

Army Research Laboratory (ARL) Cooperative Research and Development Agreement (CRADA) to jointly develop advanced GaN circuits

Recent Honors
2013 CS Industry Award for DARPA NJTT program; 2012 CS Industry Awardfor DARPA MPC program; 2011 CS Industry Award for DARPA NEXT
GaN Products
Wide selection of innovative GaN amplifiers, transistors and switches
GaN Foundry
0.25-micron GaN on SiC; 100mm wafers; DC-18 GHz applications

For more information about TriQuint defense / aerospace products and foundry services, including GaN-based amplifiers, transistors, high-power switches and integrated assembly capabilities, visit us at www.triquint.com/defense, or register to receive product updates and TriQuint’s newsletter.


 
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