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Jul 12th, 2013
Record attendance for attend 63rd IEEE ECTC in Las Vegas
IBM’s Wolfgang Sauter, General Chair, presided over this years 63rd Electronic Components and Technology Conference [ECTC] in Las Vegas.
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The highest attendance ever, over 1,300 attendees from 26 countries, listened to
377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session. 16 professional development courses were attended by over 300 participants. 95 exhibitors ( also a record) shared information on their latest products and innovations with the attendees.  Of course there was plenty of time for socializing.

Socializing at the 63 annual IEEE ECTC

 12 sessions focused on 3D/TSV, including several of the best attended sessions of the conference

The ECTC has one of the highest rejection rates of any microelectronics conference due to the large number of abstracts that are received every year. As a IEEE conference it also has one of the highest participations rates by corporations (vs Universities and Institutes) 

43% of the 646 abstracts received by the ECTC were corporate

In addition to the regular daytime sessions special pre meeting and evening sessions included:

ECTC Special Session
Chaired by Sam Karikalan of Broadcom Corporation on the collaboration between wafer foundries, OSATs, and materials and tool suppliers as the key to the success of next generation packages

ECTC Panel Session
Co-chaired by Ricky Lee of the Hong Kong University of Science and Technology and Kouchi Zhang of TU Delft & Philips Lighting on the growing market of LED for solid-state lighting

ECTC Plenary Session
Chaired by Lou Nicholls of Amkor Technologies on the “Packaging Challenges Across the Wireless Market”

CPMT Seminar
Co-chaired by Kishio Yokouchi of Fujitsu Interconnect Technologies Ltd. and Venky Sundaram of the Georgia Institute of Technology on advanced low loss dielectric materials

Modeling Special Session
Co-chaired by Yong Liu of Fairchild Semiconductor and Dan Oh of Altera on “Modeling and Simulation Challenges in 3D Systems”

Next year's conference will be held in Lake Buena Vista (Orlando) Florida, USA.



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