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Aug 19th, 2013
MEMS vendors gear up for growing demand for portable devices
STMicroelectronics, Bosch and InvenSense are gearing up to meet the demand from new Windows 8 devices, as well as tablets and smartphones slated for release in the second half of 2013, according to industry sources.
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STMicro has grabbed sensor fusion orders for most of the upcoming Windows 8 products, with mass shipments kicking off in the third quarter, the sources indicated. The MEMS vendor's 9-axis combo device, a combination of a 3-axis accelerometer, 3-axis compass and 3-axis gyroscope, has also been adopted in a major smartphone brand's high-end series set to launch in the second half of 2013, the sources said.

Another MEMS accelerometer specialist Bosch also offers 9-axis combo chips, and has cut into the supply chain for Samsung Electronics' high-end smartphone series, the sources noted. In addition, Bosch with its combo solutions has secured orders from a number of China-based brands, with shipments expected to ramp up in the third quarter, the sources added.

InvenSense, which specializes in MEMS gyroscopes, with its 6-axis combo solutions has entered the supply chains for new tablets from Acer and Asustek Computer, the sources revealed. The sources also observed that InvenSense has increased its orders to Taiwan Semiconductor Manufacturing Company (TSMC) recently to meet growing demand for handsets.

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