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Aug 26th, 2013
FINEPLACER® femto provides advanced packaging capabilities at C2MI
Bonding system installed at MiQro Innovation Collaborative Centre (Advanced Packaging sector) in Canada.
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Finetech and the MiQro Innovation Collaborative Centre (C2MI) located in Bromont, Québec, Canada, announced that C2MI has installed a FINEPLACER® femto bonding system in its advanced packaging sector. This automated, sub-micron accuracy system is designed to position and attach small electronic or opto-electronic components on printed circuit boards or substrates.

C2MI, as a Centre of Excellence, provides a state-of-the-art infrastructure for the benefits of its members. This high-technology hub provides support so that innovative concepts can be promptly commercialized. C2MI is active in die-level packaging, complex microsystems, 3D design integration and micro electromechanical systems (MEMS) development.

With a wide base of systems installed at many prestigious institutions and research centers, Finetech‘s die bonders provide unmatched solutions for advanced technology environments utilizing diverse applications. The FINEPLACER femto is a fully automated, sub-micron bonding platform that is ideal for product and process development of laser diodes, laser bars, VCSELs, photo diodes, sensors, LED bonding, MEMs, flip chip and micro optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, Indium, eutectic).


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