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Oct 30th, 2013
 
3D TSV without limits
 
Join us for this SEMI informative webinar about 3D TSV technologies, presenting mid to long term perspectives.
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Heads of the 3D TSV groups among the most renowned R&D labs will share with you their views on what is coming next with 3D TSV technologies. Mid to long term perspective will be shared with attendees. They will take the opportunity to inform the attendees about their upcoming presentation topics planned for the European 3D TSV Summit 2014. Live discussions with the speakers and moderated by Francoise von Trapp will be possible at the end of the presentations.

Speakers  
Eric Beyne
Program Director 3D System Integration
imec

3D and Photonics Convergence for Very High Bandwidth Chip to Chip Communication
Herve Ribot
Head of 3D Integration
CEA-LETI

3D Wafer Level System Integration – Fraunhofer Approach
Jurgen Wolf
Department head of HDI WLP /ASSID
Fraunhofer-IZM 

Moderator
Francoise von Trapp
Queen of 3D
3D InCites

This webinar is brought to you by the European 3D TSV Summit, main SEMI event dedicated to 3D TSV technologies.

Register now!

European 3D TSV Summit is planned in Grenoble (France) in Jan 20-22, 2014. CEA-LETI, imec and Fraunhofer-IZM will be presenting with many more executives from leading edge companies. Summit registrations are opened.Click here.

 

 
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