"As MEMS inertial sensors become more prevalent in consumer applications there is a growing need to reduce package size and increase performance, while reducing overall production costs," comments Robert Hergert, SUSS MicroTec.
The webcast is available in the archived webcast section.
MEMS inertial sensors will achieve 11% growth in 2013, becoming a $4.0B market. This industry will enjoy continuous expansion in the future, as motion sensor shipments are currently booming. “Although we see ongoing adoption in automotive and an increasing interest in high-performance applications, the strongest wafer shipments’ driver is consumer applications”, explains Laurent Robin, Activity Leader Inertial MEMS Devices & Technologies, Yole Développement.
To match these market drivers, component and die size are still being optimized, while combo approaches such as 6 and 9-axis sensors are becoming mainstream. Diverse technical solutions are being developed to optimize the front-end processing steps and the packaging of consumer inertial sensors. Yole Développement also observes that disruptive approaches are being considered for the next generation of sensors, with new detection principles and new designs such as piezo detection, MEMS-compatible magnetometers, integration of nano structures, and more.
With this live event, Yole Développement will describe a market situation update and identify the major market drivers. Front-end and packaging evolutions will be discussed with SUSS MicroTec and MEMS Industry Group. A specific focus will be also applied to the most promising new approaches. Lastly, during the questions & answers sessions with the registrants, our speakers will discuss the details of sensors recently released on the market and which are already implementing new technologies.
“Inertial sensors perform better when encapsulated in a controlled environment. This environment can be achieved through wafer level packaging. Several wafer bonding technologies can be used to achieve the hermitic environment required for high-performance inertial sensors”, explains Robert Hergert, Senior Process Development Engineer, SUSS MicroTec. Indeed, with its presentation, SUSS MicroTec will explore the design constrains, advantages and disadvantages of several of these wafer bonding techniques.
According to SUSS MicroTec, 2.5D and 3D integration can further reduce the size and improve performance by allowing the stacking of sensors and CMOS circuitry. TSVs and interposers allow for a higher level of integration while reducing the overall size of the package. During the webcast, SUSS MicroTec will present the advantages and challenges of implementing these techniques. The company will also provide an update on the state of the art wafer level packaging and integration techniques. As these methods gain broader application in the market inertial MEMS sensors will see a marked decrease in size and cost with an increase in performance.