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Aug 12th, 2014
Invensas xFD: a closer look
Tessera’s wholly-owned subsidiary Invensas recently announced that that they will license its Multi-Die Face-Down (xFDTM) semiconductor packaging technology to Micron and cooperate with Micron on the manufacturing of Micron products that incorporate xFD technology [link]. At the 2012 SMTA Int. meeting Vern Solberg of Invensas, gave a presentation on the technology and i-Micronews thought it was worth... A Closer Look.
New generations of processors require more efficient interface formats that will enable greater memory bandwidth. In addition todays thinner notebook PCs are changing the memory package density requirements for portable electronics. Traditional SO DIMM is considered too big and bulky for these slimmed down lap tops
Unequal WB lengths in face up or Face up / face down configurations
Based on all of these requirements Invensas has developed the dual face down (DFD) and Quad Face Down (QFD) packages shown below. The substrate is BT and the metallization is Cu/Ni/Au. These packages have reportedly passed standard reliability testing.
Slots in the package allow for much more uniform WB lengths. All WB is done at the same time after chips are attached. After WB and molding, solder balls are attached to produce a BGA format on 0.8mm pitch.
The QFD requires far less area than a 4 chip SO DIMM.
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