Mattson Technology recently announced the company has shipped its Alpine(TM) Etch System to a Leading Logic Customer for Advanced Packaging Applications.

Mattson Technology, Inc. today announced that a leading global semiconductor manufacturer has selected its Alpine(TM) etch system for advanced wafer-level packaging applications. The system has shipped to the manufacturer's latest 300mm packaging facility in Asia. The shipment represents the third customer placement for Mattson's etch products. Introduced in 2008, the Alpine etch system has demonstrated greater than 30% Cost-of-Ownership reduction against a leading etch competitor for the back-end-of-line integration of low-k dielectric and copper. The same technology is now extending into the packaging arena where the Cost-of-Ownership and ion control provide key differentiation against other tools available in the market.

Senior Vice President and General Manager of Mattson Technology's Plasma Products Group, Randy Matsuda, noted, "We are extremely pleased with the selection and shipment of the Alpine etch system to this long standing customer of Mattson. Their decision to place an Alpine etch system was based on proven performance from our earlier work with them. This selection of our Alpine etch system is further validation of their continued confidence in Mattson's technology and its capabilities in meeting their requirements for the wafer-level packaging applications."

Matsuda continued, "In order to keep pace with the Moore's law, our customers continue to require enabling solutions while maintaining the lowest possible cost. In response, we at Mattson continue to strive to provide answers that meet the changing requirements of the industry. The Alpine etch system for packaging is the latest example of our continued commitment to deliver unique and innovative solutions that the customers require. We look forward to working closely with our customers as their trusted solution provider."

About Alpine(TM)
The Alpine(TM) enables chipmakers to handle copper/low-k dielectric integration, resist etch back, barrier layer removal and other BEOL challenges with a single tool. The Alpine also enables back-end wafer level packaging customers to address increasingly challenging integration processes related to wafer bumping and 3D packaging processes. The Alpine features Mattson's proprietary inductively coupled plasma (ICP) source and a bias capability providing improved profile control, low-k material preservation and a wider process window. The system builds on Mattson's latest production proven platform and is designed for reliable, high-productivity, low cost-of-ownership manufacturing for sub-65 nanometer nodes and advanced packaging applications.