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May 19th, 2010
IGBT modules deliver high power density in compact form
Infineon Technologies AG is rolling out IGBT modules designed for highest power density and reliability: a PrimePACK module with 1400A in 1700V in a PrimePACK 3 packaging, and the new flagship of the EconoDUAL family, the EconoDUAL 3 with 600A in 1200V.
The new PrimePACK 3 module with the designation FF1400R17IP4 with 1400A in 1700V significantly widens the power range of the PrimePACK family. Target applications are renewable energies, traction applications, CAV (construction, commercial and agriculture vehicles) and powerful industrial drives. The new IGBT module addresses the rapidly growing requirements in the market for higher power within the same compact dimensions, paired with highest reliability. The dimensions of the PrimePACK 3 are 89mm x 250mm. The new PrimePACK 3 module—like the entire family of products—has an intelligent, optimized chip layout and module design. This innovative packaging concept results in an improved distribution and dissipation of heat, reduced thermal transfer resistance between base plate and heat sink, and minimal internal leakage inductance.
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