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Sep 2nd, 2010
OptiML™ wafer-level packaging from Tessera
Many electronic devices, including digital cameras, incorporate image sensors. Tessera's OptiML wafer-level packaging technology makes it possible to create image sensors that are thinner, more reliable and less expensive.
The end result is improved device functionality and increased board capacity, enabling the next generation of smaller, smarter, faster camera-enabled electronic devices. Tessera's OptiML Micro Via Pad packaging technology provides OEMs and camera module manufacturers with the benefits of reduced costs and accelerated time-to-market, without the need for modification or redesign of the image sensor wafer.
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