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Sep 24th, 2010
RUSNANO to open new 3D Assembly R&D center in Russia
A project to establish technology center for three-dimensional assembly of integrated circuits in Russia has secured approval from the Supervisory Council of RUSNANO.
The technology for three-dimensional assembly of semiconductor elements, or 3D assembly, is one of today’s most promising methods for reducing the size of the integrated circuit. It does this by making the substrate more dense, by raising the connectivity inside the chip, and by reducing its energy consumption. The technology makes it possible to combine components—digital and analog circuits, memory, and microelectromechanical systems—that have been produced with different technologies in one encasement. The 3D assembly raises the reliability of microelectronic goods and continues the downward trend in production costs.
In 2008 the world market for 3D assembly was $1.3 billion. Experts forecast that microelectronic products manufactured with 3D assembly will grow fivefold by 2012 after which the technology will attain widespread use. Forecasted volume in 2015 is $42 billion.
New production will be based on the unique experience of the project applicants, Voronezh Semiconductor Plant–Assembly and NANO3D SYSTEMS LLC.
“This project will give Russian manufacturers of electronics a component base created with state-of-the-art assembly technology. It will lower product costs and reduce dependence on foreign suppliers, making Russian electronics companies more competitive in global markets. We anticipate that the project will stimulate other advances in the microelectronic sector,” Evengy Evdokimov, RUSNANO managing director, explained.
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